Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
84-PRS12022-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3325	76.92	- + Ajouter au panier Demander	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS13053-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2445	76.92	- + Ajouter au panier Demander	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS13125-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2250	76.92	- + Ajouter au panier Demander	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
550-10-652M35-001152 BGA SOLDER TAIL Preci-Dip	3912	74.27	- + Ajouter au panier Demander	Datenblatt	Bulk	550	Active	BGA	652 (35 x 35)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
510-13-361-19-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2812	77.24	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	361 (19 x 19)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-361-19-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2322	77.24	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	361 (19 x 19)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-361-19-000003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3177	77.24	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	361 (19 x 19)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-600M35-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	2918	74.53	- + Ajouter au panier Demander	Datenblatt	Bulk	558	Active	BGA	600 (35 x 35)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-600M35-001105 CONN SOCKET PGA 600POS GOLD Preci-Dip	3057	74.83	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	600 (35 x 35)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
18-PRS17041-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2532	78.44	- + Ajouter au panier Demander	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PRS15057-12 ZIF PGA SOCKET 56PIN 15X15 Aries Electronics	3488	78.54	- + Ajouter au panier Demander		-	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PLS14031-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3845	78.54	- + Ajouter au panier Demander	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PLS15057-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2763	78.54	- + Ajouter au panier Demander	Datenblatt	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PRS14031-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2278	78.54	- + Ajouter au panier Demander	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
44-6552-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	3103	78.91	- + Ajouter au panier Demander	Datenblatt	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3554-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2682	78.91	- + Ajouter au panier Demander	Datenblatt	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6553-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2098	78.91	- + Ajouter au panier Demander	Datenblatt	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3551-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2446	78.91	- + Ajouter au panier Demander	Datenblatt	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3552-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	3933	78.91	- + Ajouter au panier Demander	Datenblatt	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3553-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2330	78.91	- + Ajouter au panier Demander	Datenblatt	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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