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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
44-6551-16

44-6551-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

3848 78.91
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44-6551-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6554-16

44-6554-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2252 78.91
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44-6554-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
85-PRS11008-12

85-PRS11008-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3718 77.11
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85-PRS11008-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
518-77-600M35-001106

518-77-600M35-001106

CONN SOCKET PGA 600POS GOLD

Preci-Dip

3831 76.23
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518-77-600M35-001106

Datenblatt

Bulk 518 Active PGA 600 (35 x 35) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
101-PRS13022-12

101-PRS13022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2001 79.93
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101-PRS13022-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
101-PRS13023-12

101-PRS13023-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2513 79.93
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101-PRS13023-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16017-12

30-PLS16017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2563 80.41
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30-PLS16017-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16018-12

30-PLS16018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3275 80.41
- +

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30-PLS16018-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16020-12

30-PLS16020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2684 80.41
- +

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30-PLS16020-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16022-12

30-PLS16022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3597 80.41
- +

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Demander

30-PLS16022-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16017-12

30-PRS16017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3934 80.41
- +

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Demander

30-PRS16017-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16018-12

30-PRS16018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2877 80.41
- +

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Demander

30-PRS16018-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16020-12

30-PRS16020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2583 80.41
- +

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Demander

30-PRS16020-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16022-12

30-PRS16022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2286 80.41
- +

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Demander

30-PRS16022-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PLS12005-12

108-PLS12005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3680 81.03
- +

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Demander

108-PLS12005-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PLS12024-12

108-PLS12024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3541 81.03
- +

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Demander

108-PLS12024-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PRS12024-12

108-PRS12024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2664 81.03
- +

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Demander

108-PRS12024-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PRS13129-12

108-PRS13129-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2697 81.03
- +

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Demander

108-PRS13129-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
48-3551-16

48-3551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3495 81.47
- +

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Demander

48-3551-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3552-16

48-3552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

3383 81.47
- +

Ajouter au panier

Demander

48-3552-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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