Bienvenue à visiter Élément Technology Co., Ltd.!

+86 15361839241 +86 0755-23603516
Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
558-10-576M30-001104

558-10-576M30-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3469 71.55
- +

Ajouter au panier

Demander

558-10-576M30-001104

Datenblatt

Bulk 558 Active BGA 576 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-576M30-001105

518-77-576M30-001105

CONN SOCKET PGA 576POS GOLD

Preci-Dip

2951 71.84
- +

Ajouter au panier

Demander

518-77-576M30-001105

Datenblatt

Bulk 518 Active PGA 576 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
42-3551-16

42-3551-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

2345 75.34
- +

Ajouter au panier

Demander

42-3551-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3552-16

42-3552-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

2874 75.34
- +

Ajouter au panier

Demander

42-3552-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3553-16

42-3553-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3333 75.34
- +

Ajouter au panier

Demander

42-3553-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6551-16

42-6551-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

2042 75.34
- +

Ajouter au panier

Demander

42-6551-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6552-16

42-6552-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

2213 75.34
- +

Ajouter au panier

Demander

42-6552-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6553-16

42-6553-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

2937 75.34
- +

Ajouter au panier

Demander

42-6553-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3554-16

42-3554-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

2049 75.34
- +

Ajouter au panier

Demander

42-3554-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6554-16

42-6554-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3433 75.34
- +

Ajouter au panier

Demander

42-6554-16

Datenblatt

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
175-PGM16003-11

175-PGM16003-11

CONN SOCKET PGA GOLD

Aries Electronics

3019 75.45
- +

Ajouter au panier

Demander

175-PGM16003-11

Datenblatt

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
80-PRS13127-12

80-PRS13127-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2796 76.12
- +

Ajouter au panier

Demander

80-PRS13127-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
518-77-576M30-001106

518-77-576M30-001106

CONN SOCKET PGA 576POS GOLD

Preci-Dip

2924 73.18
- +

Ajouter au panier

Demander

518-77-576M30-001106

Datenblatt

Bulk 518 Active PGA 576 (30 x 30) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
44-PLS12017-12

44-PLS12017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2230 76.29
- +

Ajouter au panier

Demander

44-PLS12017-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
44-PRS12017-12

44-PRS12017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2379 76.29
- +

Ajouter au panier

Demander

44-PRS12017-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PLS10001-12

100-PLS10001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3205 76.51
- +

Ajouter au panier

Demander

100-PLS10001-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS11010-12

84-PRS11010-12

ZIF 11X11 84PIN FOOTPRN 11010

Aries Electronics

2887 76.92
- +

Ajouter au panier

Demander

- PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PLS10003-12

84-PLS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2819 76.92
- +

Ajouter au panier

Demander

84-PLS10003-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS10003-12

84-PRS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3437 76.92
- +

Ajouter au panier

Demander

84-PRS10003-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
84-PRS11032-12

84-PRS11032-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2727 76.92
- +

Ajouter au panier

Demander

84-PRS11032-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
Total 21991 Records«Prev1... 716717718719720721722723...1100Next»
Demander un devis
Numéro de pièce
Quantité
Contact
E-Mail
Commentaires
  • Maison

    Maison

    Produits

    Produits

    Téléphone

    Téléphone

    Utilisateurs

    Utilisateurs