Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
36-6554-16 CONN IC DIP SOCKET ZIF 36POS Aries Electronics	3854	65.73	- + Ajouter au panier Demander	Datenblatt	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
514-83-576M30-001148 CONN SOCKET BGA 576POS GOLD Preci-Dip	3323	63.16	- + Ajouter au panier Demander	Datenblatt	Bulk	514	Active	BGA	576 (30 x 30)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-3518-11H CONN IC DIP SOCKET 24POS GOLD Aries Electronics	3053	65.94	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
1109042 537 ZIF TEST SCKT LIVE BUG TYPE Aries Electronics	3298	66.02	- + Ajouter au panier Demander	Datenblatt	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1109043 538 ZIF TEST SCKT LIVE BUG TYPE Aries Electronics	3330	66.02	- + Ajouter au panier Demander	Datenblatt	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
518-77-500M30-001106 CONN SOCKET PGA 500POS GOLD Preci-Dip	2755	63.52	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	500 (30 x 30)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
44-6556-41 CONN IC DIP SOCKET 44POS GOLD Aries Electronics	3785	66.24	- + Ajouter au panier Demander	Datenblatt	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
550-10-576M30-001152 BGA SOLDER TAIL Preci-Dip	2660	63.69	- + Ajouter au panier Demander	Datenblatt	Bulk	550	Active	BGA	576 (30 x 30)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-504M29-001106 CONN SOCKET PGA 504POS GOLD Preci-Dip	3945	64.03	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	504 (29 x 29)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
510-13-299-20-096003 PIN GRID ARRAY SOCKETS Mill-Max Manufacturing Corp.	3743	66.99	- + Ajouter au panier Demander		Tube	510	Active	PGA	299 (20 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-299-20-096001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2882	66.99	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	299 (20 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-299-20-096002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3181	66.99	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	299 (20 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-520M31-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	3260	64.59	- + Ajouter au panier Demander	Datenblatt	Bulk	558	Active	BGA	520 (31 x 31)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-520M31-001105 CONN SOCKET PGA 520POS GOLD Preci-Dip	2758	64.85	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	520 (31 x 31)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
209-PGM17020-10H CONN SOCKET PGA GOLD Aries Electronics	2009	67.91	- + Ajouter au panier Demander	Datenblatt	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
558-10-560M33-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	3771	65.50	- + Ajouter au panier Demander	Datenblatt	Bulk	558	Active	PGA	560 (33 x 33)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
48-6556-41 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2827	68.44	- + Ajouter au panier Demander	Datenblatt	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
514-83-600M35-001148 CONN SOCKET BGA 600POS GOLD Preci-Dip	2823	65.79	- + Ajouter au panier Demander	Datenblatt	Bulk	514	Active	BGA	600 (35 x 35)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-520M31-001106 CONN SOCKET PGA 520POS GOLD Preci-Dip	3632	66.06	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	520 (31 x 31)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
40-6554-16 CONN IC DIP SOCKET ZIF 40POS Aries Electronics	3692	68.99	- + Ajouter au panier Demander	Datenblatt	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled

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