Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
614-87-428-31-012101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2988	1.67	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICF-314-T-O-TR .100 SURFACE MOUNT SCREW MACHIN Samtec Inc.	3312	1.79	- + Ajouter au panier Demander		Tape & Reel (TR)	iCF	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)
122-87-322-41-001101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	3593	1.67	- + Ajouter au panier Demander	Datenblatt	Bulk	122	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-422-41-001101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	2032	1.67	- + Ajouter au panier Demander	Datenblatt	Bulk	122	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-322-41-001101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	3380	1.67	- + Ajouter au panier Demander	Datenblatt	Bulk	123	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-422-41-001101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	2805	1.67	- + Ajouter au panier Demander	Datenblatt	Bulk	123	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-002101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	3884	1.67	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-324-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3004	1.73	- + Ajouter au panier Demander	Datenblatt	Bulk	612	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-004101 CONN IC DIP SOCKET 10POS GOLD Preci-Dip	3368	1.73	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-3513-10T CONN IC DIP SOCKET 12POS GOLD Aries Electronics	3827	1.80	- + Ajouter au panier Demander	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-00 CONN SOCKET SIP 8POS GOLD Aries Electronics	3032	1.80	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	SIP	8 (1 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-00 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3677	1.80	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
13-0518-10T CONN SOCKET SIP 13POS GOLD Aries Electronics	3292	1.80	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	SIP	13 (1 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-312-41-105191 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	3428	1.73	- + Ajouter au panier Demander		Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 40-HZL/07-TT CONN IC DIP SOCKET 40POS GOLD Assmann WSW Components	3262	1.80	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
116-87-318-41-001101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	2027	1.68	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-608-10-002101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	2349	1.75	- + Ajouter au panier Demander	Datenblatt	Bulk	299	Active	DIP, 0.6 (15.24mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-628-41-001101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3663	1.69	- + Ajouter au panier Demander		Bulk	115	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-003101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3269	1.69	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-628-41-003101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3357	1.81	- + Ajouter au panier Demander	Datenblatt	Bulk	115	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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