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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-83-428-41-003101

115-83-428-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2979 1.70
- +

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Demander

115-83-428-41-003101

Datenblatt

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-009101

116-87-320-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2824 1.70
- +

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Demander

116-87-320-41-009101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-009101

116-87-420-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3183 1.81
- +

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Demander

116-87-420-41-009101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-620-41-105101

117-83-620-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3442 1.70
- +

Ajouter au panier

Demander

117-83-620-41-105101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-624-41-001101

614-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3662 1.69
- +

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Demander

614-83-624-41-001101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-422-41-001101

612-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3983 1.70
- +

Ajouter au panier

Demander

612-83-422-41-001101

Datenblatt

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
214-44-624-01-670800

214-44-624-01-670800

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

2930 1.82
- +

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Demander

214-44-624-01-670800

Datenblatt

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
D95014-42

D95014-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

2699 1.82
- +

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Demander

D95014-42

Datenblatt

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
116-87-428-41-018101

116-87-428-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2705 1.88
- +

Ajouter au panier

Demander

116-87-428-41-018101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-018101

116-87-628-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3430 1.88
- +

Ajouter au panier

Demander

116-87-628-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-424-41-105101

110-83-424-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3034 1.83
- +

Ajouter au panier

Demander

110-83-424-41-105101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-006101

116-83-624-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2879 1.91
- +

Ajouter au panier

Demander

116-83-624-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-228-10-001101

410-83-228-10-001101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip

3293 1.84
- +

Ajouter au panier

Demander

410-83-228-10-001101

Datenblatt

Bulk 410 Active Zig-Zag, Left Stackable 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-228-10-002101

410-83-228-10-002101

CONN ZIG-ZAG 28POS GOLD

Preci-Dip

3830 1.84
- +

Ajouter au panier

Demander

410-83-228-10-002101

Datenblatt

Bulk 410 Active Zig-Zag, Right Stackable 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICF-308-T-I

ICF-308-T-I

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

3270 1.91
- +

Ajouter au panier

Demander

Tube iCF Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
11-0513-10

11-0513-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2861 1.91
- +

Ajouter au panier

Demander

11-0513-10

Datenblatt

Bulk 0513 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-624-41-105101

110-83-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2494 1.71
- +

Ajouter au panier

Demander

110-83-624-41-105101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-632-41-001101

614-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3888 1.71
- +

Ajouter au panier

Demander

614-87-632-41-001101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-43-108-41-001000

917-43-108-41-001000

CONN TRANSIST TO-5 8POS GOLD

Mill-Max Manufacturing Corp.

3958 1.83
- +

Ajouter au panier

Demander

917-43-108-41-001000

Datenblatt

Tube 917 Active Transistor, TO-5 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-43-208-41-001000

917-43-208-41-001000

CONN SOCKET TRANSIST TO-100 8POS

Mill-Max Manufacturing Corp.

2125 1.83
- +

Ajouter au panier

Demander

917-43-208-41-001000

Datenblatt

Tube 917 Active Transistor, TO-100 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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