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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-312-41-004101

116-83-312-41-004101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2082 1.74
- +

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Demander

116-83-312-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-007101

116-83-318-41-007101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3046 1.74
- +

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Demander

116-83-318-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-007101

116-87-422-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2984 1.75
- +

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Demander

116-87-422-41-007101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-003101

116-83-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3780 1.75
- +

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Demander

116-83-420-41-003101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-068-09-001101

510-87-068-09-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3948 1.75
- +

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Demander

510-87-068-09-001101

Datenblatt

Bulk 510 Active PGA 68 (9 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SMPX-84LCC-P

SMPX-84LCC-P

SMT PLCC SOCKET 84P POLARISED RO

Kycon, Inc.

2403 1.86
- +

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Demander

SMPX-84LCC-P

Datenblatt

Tube SMPX Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
SMPX-84LCC-N

SMPX-84LCC-N

SMT PLCC SOCKET 84P NON POLARISE

Kycon, Inc.

2169 1.86
- +

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Demander

SMPX-84LCC-N

Datenblatt

Tube SMPX Active PLCC 84 (4 x 21) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
110-83-324-41-105161

110-83-324-41-105161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3636 1.75
- +

Ajouter au panier

Demander

110-83-324-41-105161

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-006101

116-83-422-41-006101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3674 1.75
- +

Ajouter au panier

Demander

116-83-422-41-006101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-640-41-003101

115-87-640-41-003101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3460 1.92
- +

Ajouter au panier

Demander

115-87-640-41-003101

Datenblatt

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-432-41-005101

117-83-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2277 1.75
- +

Ajouter au panier

Demander

117-83-432-41-005101

Datenblatt

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-628-41-117101

114-83-628-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3007 1.75
- +

Ajouter au panier

Demander

114-83-628-41-117101

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-628-41-134161

114-83-628-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2205 1.75
- +

Ajouter au panier

Demander

114-83-628-41-134161

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-012101

116-83-320-41-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2003 1.76
- +

Ajouter au panier

Demander

116-83-320-41-012101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-064-10-001101

510-87-064-10-001101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

3400 1.76
- +

Ajouter au panier

Demander

510-87-064-10-001101

Datenblatt

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-064-10-051101

510-87-064-10-051101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

2989 1.76
- +

Ajouter au panier

Demander

510-87-064-10-051101

Datenblatt

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-628-41-134191

114-83-628-41-134191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2747 1.81
- +

Ajouter au panier

Demander

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-314-41-002101

124-83-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2766 1.77
- +

Ajouter au panier

Demander

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-006101

116-87-428-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3589 1.77
- +

Ajouter au panier

Demander

116-87-428-41-006101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-0513-10T

12-0513-10T

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3646 1.89
- +

Ajouter au panier

Demander

12-0513-10T

Datenblatt

Bulk 0513 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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