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| Photos | Le fabricant# | Stocks | Prix | Quantité | Tableau | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-83-628-41-605101CONN IC DIP SOCKET 28POS GOLD |
2739 | 1.66 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
PX-52LCCLEADLESS CHIP CARRIER 52P PBT RO |
3165 | 1.66 |
Ajouter au panierDemander |
Tube | PX | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
SMPX-68LCC-NSMT PLCC SOCKET 68P NON POLARISE |
3606 | 1.66 |
Ajouter au panierDemander |
Datenblatt |
Tube | SMPX | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
SMPX-68LCC-PSMT PLCC SOCKET 68P POLARISED RO |
2537 | 1.66 |
Ajouter au panierDemander |
Datenblatt |
Tube | SMPX | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
114-83-318-41-134191CONN IC DIP SOCKET 18POS GOLD |
3865 | 1.60 |
Ajouter au panierDemander |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
116-87-424-41-006101CONN IC DIP SOCKET 24POS GOLD |
3717 | 1.56 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-420-31-012101CONN IC DIP SOCKET 20POS GOLD |
2989 | 1.56 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 614 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
540-88-052-24-008CONN SOCKET PLCC 52POS TIN |
3792 | 1.56 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 540 | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
10-2513-10TCONN IC DIP SOCKET 10POS GOLD |
3994 | 1.67 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-3513-10TCONN IC DIP SOCKET 10POS GOLD |
2593 | 1.67 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
09-0518-11CONN SOCKET SIP 9POS GOLD |
2986 | 1.67 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-0518-10TCONN SOCKET SIP 12POS GOLD |
3148 | 1.67 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-1518-10TCONN IC DIP SOCKET 12POS GOLD |
2782 | 1.67 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
116-87-320-41-002101CONN IC DIP SOCKET 20POS GOLD |
2468 | 1.56 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-036-06-000101CONN SOCKET PGA 36POS GOLD |
3995 | 1.56 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 510 | Active | PGA | 36 (6 x 6) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-420-41-018101CONN IC DIP SOCKET 20POS GOLD |
2569 | 1.67 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-83-422-41-105101CONN IC DIP SOCKET 22POS GOLD |
2860 | 1.68 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
214-99-308-01-670799STANDRD SOLDER TAIL DIP SOCKET |
2593 | 1.68 |
Ajouter au panierDemander |
Tape & Reel (TR) | 214 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polyamide (PA46), Nylon 4/6 | |
|
|
214-44-308-01-670799STANDRD SOLDER TAIL DIP SOCKET |
2384 | 1.68 |
Ajouter au panierDemander |
Tape & Reel (TR) | 214 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polyamide (PA46), Nylon 4/6 | |
|
410-83-224-10-001101CONN ZIG-ZAG 24POS GOLD |
2142 | 1.62 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 410 | Active | Zig-Zag, Left Stackable | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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