Sockets for ICs, Transistors - Élément Technology Co., Ltd.

English

Deutsch

Русский

Türkiye

Français

Bienvenue à visiter Élément Technology Co., Ltd.！

+86 15361839241 +86 0755-23603516

Panier

Toutes les catégories

Autres catégories de produits >>

Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
48-6575-16 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	3175	60.53	- + Ajouter au panier Demander	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6556-40 CONN IC DIP SOCKET 44POS GOLD Aries Electronics	2004	60.87	- + Ajouter au panier Demander	Datenblatt	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
40-6556-41 CONN IC DIP SOCKET 40POS GOLD Aries Electronics	2497	60.92	- + Ajouter au panier Demander	Datenblatt	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
558-10-500M30-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	2473	58.48	- + Ajouter au panier Demander	Datenblatt	Bulk	558	Active	PGA	500 (30 x 30)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-504M29-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	2874	58.95	- + Ajouter au panier Demander	Datenblatt	Bulk	558	Active	PGA	504 (29 x 29)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
558-10-478M26-131104 BGA SURFACE MOUNT 1.27MM Preci-Dip	2948	59.38	- + Ajouter au panier Demander	Datenblatt	Bulk	558	Active	BGA	478 (26 x 26)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-478M26-131105 CONN SOCKET PGA 478POS GOLD Preci-Dip	2122	58.27	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	478 (26 x 26)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
558-10-480M29-001104 BGA SURFACE MOUNT 1.27MM Preci-Dip	3762	59.62	- + Ajouter au panier Demander	Datenblatt	Bulk	558	Active	BGA	480 (29 x 29)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-480M29-001105 CONN SOCKET PGA 480POS GOLD Preci-Dip	2447	59.86	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	480 (29 x 29)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
48-6556-40 CONN IC DIP SOCKET 48POS GOLD Aries Electronics	2949	62.52	- + Ajouter au panier Demander	Datenblatt	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
510-13-273-21-125001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3405	62.69	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	273 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-273-21-125002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2177	62.69	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	273 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-273-21-125003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2670	62.69	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	273 (21 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
192-PGM17043-10H CONN SOCKET PGA GOLD Aries Electronics	2817	63.09	- + Ajouter au panier Demander	Datenblatt	Bulk	PGM	Active	PGA	-	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
42-6556-41 CONN IC DIP SOCKET 42POS GOLD Aries Electronics	2077	63.17	- + Ajouter au panier Demander	Datenblatt	Bulk	6556	Active	DIP, 0.6 (15.24mm) Row Spacing	42 (2 x 21)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder Cup	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyphenylene Sulfide (PPS), Glass Filled
518-77-478M26-131106 CONN SOCKET PGA 478POS GOLD Preci-Dip	3932	60.73	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	478 (26 x 26)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
558-10-520M31-001101 PGA SOLDER TAIL 1.27MM Preci-Dip	3430	60.82	- + Ajouter au panier Demander	Datenblatt	Bulk	558	Active	PGA	520 (31 x 31)	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.050 (1.27mm)	Gold	10.0µin (0.25µm)	Brass	FR4 Epoxy Glass
518-77-480M29-001106 CONN SOCKET PGA 480POS GOLD Preci-Dip	3353	60.98	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	PGA	480 (29 x 29)	0.050 (1.27mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.050 (1.27mm)	Gold	Flash	Brass	FR4 Epoxy Glass
100-PRS10001-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2475	63.77	- + Ajouter au panier Demander	Datenblatt	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
514-83-560M33-001148 CONN SOCKET BGA 560POS GOLD Preci-Dip	2318	61.41	- + Ajouter au panier Demander	Datenblatt	Bulk	514	Active	BGA	560 (33 x 33)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

Total 21991 Records«Prev 1... 711 712 713 714715716 717 718...1100 Next»

Demander un devis

Maison

Produits

Téléphone

Utilisateurs

Skype
Tel

+86 19886284706
Contactez
Whatsapp
GoTop