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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-9513-11

10-9513-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3233 5.58
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10-9513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-3513-10T

30-3513-10T

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2129 5.58
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30-3513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-318-T-M

APA-318-T-M

ADAPTER PLUG

Samtec Inc.

2949 5.58
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Tube APA Active - 18 (2 x 9) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
714-43-119-31-018000

714-43-119-31-018000

CONN SOCKET SIP 19POS GOLD

Mill-Max Manufacturing Corp.

2358 5.58
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714-43-119-31-018000

Datenblatt

Bulk 714 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-83-950-41-001101

612-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2942 5.26
- +

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Demander

612-83-950-41-001101

Datenblatt

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-322-T-A

APA-322-T-A

ADAPTER PLUG

Samtec Inc.

3638 5.59
- +

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Demander

Bulk APA Active - 22 (2 x 11) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-422-T-A

APA-422-T-A

ADAPTER PLUG

Samtec Inc.

3361 5.59
- +

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Demander

Bulk APA Active - 22 (2 x 11) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-87-175-15-061101

510-87-175-15-061101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

3891 5.28
- +

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Demander

510-87-175-15-061101

Datenblatt

Bulk 510 Active PGA 175 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-16-001101

510-87-175-16-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

3373 5.28
- +

Ajouter au panier

Demander

510-87-175-16-001101

Datenblatt

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-16-071101

510-87-175-16-071101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

3191 5.28
- +

Ajouter au panier

Demander

510-87-175-16-071101

Datenblatt

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-175-16-072101

510-87-175-16-072101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

3838 5.28
- +

Ajouter au panier

Demander

510-87-175-16-072101

Datenblatt

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-964-41-001101

614-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3617 5.29
- +

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Demander

614-83-964-41-001101

Datenblatt

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-3518-10H

24-3518-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2572 5.60
- +

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Demander

24-3518-10H

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
121-83-648-41-001101

121-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2008 5.30
- +

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Demander

121-83-648-41-001101

Datenblatt

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-176-16-001101

510-87-176-16-001101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

2325 5.31
- +

Ajouter au panier

Demander

510-87-176-16-001101

Datenblatt

Bulk 510 Active PGA 176 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-176-16-071101

510-87-176-16-071101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

3601 5.31
- +

Ajouter au panier

Demander

510-87-176-16-071101

Datenblatt

Bulk 510 Active PGA 176 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-176-15-061101

510-87-176-15-061101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

3028 5.31
- +

Ajouter au panier

Demander

510-87-176-15-061101

Datenblatt

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-624-SGT

ICO-624-SGT

CONN IC DIP SOCKET 24POS GOLD

Samtec Inc.

2337 5.62
- +

Ajouter au panier

Demander

ICO-624-SGT

Datenblatt

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
10-6501-20

10-6501-20

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

2600 5.62
- +

Ajouter au panier

Demander

10-6501-20

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6501-30

10-6501-30

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3992 5.62
- +

Ajouter au panier

Demander

10-6501-30

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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