Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-87-179-18-111101 CONN SOCKET PGA 179POS GOLD Preci-Dip	3203	5.40	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	179 (18 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
07-0511-10 CONN SOCKET SIP 7POS TIN Aries Electronics	2023	5.75	- + Ajouter au panier Demander	Datenblatt	Bulk	511	Active	SIP	7 (1 x 7)	0.100 (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100 (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-180-17-081101 CONN SOCKET PGA 180POS GOLD Preci-Dip	2504	5.43	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	180 (17 x 17)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-18-111101 CONN SOCKET PGA 180POS GOLD Preci-Dip	2453	5.43	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	180 (18 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-15-001101 CONN SOCKET PGA 180POS GOLD Preci-Dip	2752	5.43	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	180 (15 x 15)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-15-041101 CONN SOCKET PGA 180POS GOLD Preci-Dip	2402	5.43	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	180 (15 x 15)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-656-41-105101 CONN IC DIP SOCKET 56POS GOLD Preci-Dip	3755	5.43	- + Ajouter au panier Demander	Datenblatt	Bulk	117	Active	DIP, 0.6 (15.24mm) Row Spacing	56 (2 x 28)	0.070 (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-011101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3568	5.43	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-3508-20 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2574	5.77	- + Ajouter au panier Demander	Datenblatt	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-3508-30 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2167	5.77	- + Ajouter au panier Demander	Datenblatt	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-101 CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3114	5.77	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-10T CONN IC DIP SOCKET 40POS GOLD Aries Electronics	3069	5.77	- + Ajouter au panier Demander	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-129-41-013000 CONN SOCKET SIP 29POS GOLD Mill-Max Manufacturing Corp.	2003	5.77	- + Ajouter au panier Demander	Datenblatt	Bulk	346	Active	SIP	29 (1 x 29)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-129-41-013000 CONN SOCKET SIP 29POS GOLD Mill-Max Manufacturing Corp.	2807	5.77	- + Ajouter au panier Demander	Datenblatt	Bulk	346	Active	SIP	29 (1 x 29)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-180-15-002101 CONN SOCKET PGA 180POS GOLD Preci-Dip	2028	5.43	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	180 (15 x 15)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-004101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	3717	5.45	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-007101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	2500	6.09	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-002101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	3349	5.46	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-114-13-001101 CONN SOCKET PGA 114POS GOLD Preci-Dip	3244	5.46	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	114 (13 x 13)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-114-13-061101 CONN SOCKET PGA 114POS GOLD Preci-Dip	2173	5.46	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	114 (13 x 13)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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