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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-43-628-41-001000

123-43-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3336 5.36
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123-43-628-41-001000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-640-41-009101

116-83-640-41-009101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2538 5.07
- +

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116-83-640-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-127-41-013000

346-93-127-41-013000

CONN SOCKET SIP 27POS GOLD

Mill-Max Manufacturing Corp.

2682 5.37
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346-93-127-41-013000

Datenblatt

Bulk 346 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-83-324-10-001101

299-83-324-10-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3794 5.08
- +

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299-83-324-10-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-43-127-41-013000

346-43-127-41-013000

CONN SOCKET SIP 27POS GOLD

Mill-Max Manufacturing Corp.

2923 5.37
- +

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Demander

346-43-127-41-013000

Datenblatt

Bulk 346 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-100-15-101101

510-83-100-15-101101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3235 5.09
- +

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Demander

510-83-100-15-101101

Datenblatt

Bulk 510 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-008101

116-83-642-41-008101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3406 5.09
- +

Ajouter au panier

Demander

116-83-642-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-169-17-101101

510-87-169-17-101101

CONN SOCKET PGA 169POS GOLD

Preci-Dip

3326 5.10
- +

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Demander

510-87-169-17-101101

Datenblatt

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-011101

116-87-642-41-011101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2410 5.11
- +

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Demander

116-87-642-41-011101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-14-031101

510-87-180-14-031101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2074 5.43
- +

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Demander

510-87-180-14-031101

Datenblatt

Bulk 510 Active PGA 180 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-15-001101

510-83-100-15-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3140 5.09
- +

Ajouter au panier

Demander

510-83-100-15-001101

Datenblatt

Bulk 510 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-6513-11

18-6513-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3476 5.41
- +

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Demander

18-6513-11

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-101H

14-3518-101H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3961 5.41
- +

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Demander

14-3518-101H

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-107-12-051101

510-83-107-12-051101

CONN SOCKET PGA 107POS GOLD

Preci-Dip

3375 5.12
- +

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Demander

510-83-107-12-051101

Datenblatt

Bulk 510 Active PGA 107 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-316-T-C

APA-316-T-C

ADAPTER PLUG

Samtec Inc.

2995 5.41
- +

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Demander

Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-632-T-J

APA-632-T-J

ADAPTER PLUG

Samtec Inc.

2847 5.41
- +

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Demander

Tube APA Active - 32 (2 x 16) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
14-3518-11H

14-3518-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3253 5.42
- +

Ajouter au panier

Demander

14-3518-11H

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-181-14-031101

510-87-181-14-031101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

3725 5.46
- +

Ajouter au panier

Demander

510-87-181-14-031101

Datenblatt

Bulk 510 Active PGA 181 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-101-15-101101

510-83-101-15-101101

CONN SOCKET PGA 101POS GOLD

Preci-Dip

2863 5.14
- +

Ajouter au panier

Demander

510-83-101-15-101101

Datenblatt

Bulk 510 Active PGA 101 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
26-3513-10

26-3513-10

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3140 5.43
- +

Ajouter au panier

Demander

26-3513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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