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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-6513-10H

06-6513-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2167 2.98
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06-6513-10H

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Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0513-11

11-0513-11

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2179 2.98
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11-0513-11

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Bulk 0513 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0503-20

05-0503-20

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2396 2.98
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05-0503-20

Datenblatt

Bulk 0503 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
05-0503-30

05-0503-30

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3439 2.98
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05-0503-30

Datenblatt

Bulk 0503 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
12-0518-00

12-0518-00

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2010 2.98
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12-0518-00

Datenblatt

Bulk 518 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-1518-00

12-1518-00

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3733 2.98
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12-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-11

17-0518-11

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2632 2.98
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17-0518-11

Datenblatt

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
21-0518-10H

21-0518-10H

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3964 2.98
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21-0518-10H

Datenblatt

Bulk 518 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-10

25-0518-10

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3922 2.98
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25-0518-10

Datenblatt

Bulk 518 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-0508-20

06-0508-20

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3719 2.98
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06-0508-20

Datenblatt

Bulk 508 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
06-0508-30

06-0508-30

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2827 2.98
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06-0508-30

Datenblatt

Bulk 508 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
06-1508-20

06-1508-20

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2981 2.98
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06-1508-20

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
06-1508-30

06-1508-30

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2423 2.98
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06-1508-30

Datenblatt

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
346-93-115-41-013000

346-93-115-41-013000

CONN SOCKET SIP 15POS GOLD

Mill-Max Manufacturing Corp.

3170 2.98
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346-93-115-41-013000

Datenblatt

Bulk 346 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-115-41-013000

346-43-115-41-013000

CONN SOCKET SIP 15POS GOLD

Mill-Max Manufacturing Corp.

2583 2.98
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346-43-115-41-013000

Datenblatt

Bulk 346 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
XR2P1041

XR2P1041

CONN SOCKET SIP 10POS GOLD

Omron Electronics Inc-EMC Div

3403 2.99
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XR2P1041

Datenblatt

Bulk XR2 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
116-87-642-41-018101

116-87-642-41-018101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3267 2.81
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116-87-642-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-648-41-105101

110-87-648-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2124 2.82
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110-87-648-41-105101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-648-41-001101

614-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2820 2.82
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Demander

614-87-648-41-001101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
23-0518-10T

23-0518-10T

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3730 3.00
- +

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23-0518-10T

Datenblatt

Bulk 518 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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