Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
110-83-432-41-105101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	3223	2.68	- + Ajouter au panier Demander	Datenblatt	Bulk	110	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-105191 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3114	2.74	- + Ajouter au panier Demander		Bulk	110	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-018101 CONN IC DIP SOCKET 40POS GOLD Preci-Dip	3897	2.68	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-089-12-051101 CONN SOCKET PGA 89POS GOLD Preci-Dip	2146	2.68	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	89 (12 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-089-13-082101 CONN SOCKET PGA 89POS GOLD Preci-Dip	3040	2.68	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	89 (13 x 13)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-314-10-001101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	2758	2.68	- + Ajouter au panier Demander	Datenblatt	Bulk	299	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-003101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2674	2.69	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-420-41-002101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	3094	2.96	- + Ajouter au panier Demander		Bulk	124	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-4513-10H CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3448	2.87	- + Ajouter au panier Demander	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.4 (10.16mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-2513-11 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3956	2.87	- + Ajouter au panier Demander	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-3513-11 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3439	2.87	- + Ajouter au panier Demander	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
17-0513-10 CONN SOCKET SIP 17POS GOLD Aries Electronics	3327	2.87	- + Ajouter au panier Demander	Datenblatt	Bulk	0513	Active	SIP	17 (1 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
22-0518-10T CONN SOCKET SIP 22POS GOLD Aries Electronics	2317	2.87	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	SIP	22 (1 x 22)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-10 CONN SOCKET SIP 24POS GOLD Aries Electronics	3603	2.87	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	SIP	24 (1 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
612-83-432-41-001101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	3064	2.71	- + Ajouter au panier Demander	Datenblatt	Bulk	612	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-632-41-001101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	2512	2.71	- + Ajouter au panier Demander	Datenblatt	Bulk	612	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
2-1814640-0 CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors	3370	2.88	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester
08-2513-10H CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3311	2.89	- + Ajouter au panier Demander	Datenblatt	Bulk	Lo-PRO®file, 513	Active	DIP, 0.2 (5.08mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
117-83-432-41-105101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	2447	2.71	- + Ajouter au panier Demander	Datenblatt	Bulk	117	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.070 (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-008101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2303	2.72	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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