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| Photos | Le fabricant# | Stocks | Prix | Quantité | Tableau | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
08-2513-11HCONN IC DIP SOCKET 8POS GOLD |
2204 | 3.40 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
29-0518-10CONN SOCKET SIP 29POS GOLD |
2523 | 3.40 |
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Datenblatt |
Bulk | 518 | Active | SIP | 29 (1 x 29) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
07-0508-20CONN SOCKET SIP 7POS GOLD |
2002 | 3.40 |
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Datenblatt |
Bulk | 508 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
614-83-640-41-001101CONN IC DIP SOCKET 40POS GOLD |
2444 | 3.30 |
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Datenblatt |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-628-41-002101CONN IC DIP SOCKET 28POS GOLD |
2213 | 3.41 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-428-41-002101CONN IC DIP SOCKET 28POS GOLD |
3731 | 3.31 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-624-41-001101CONN IC DIP SOCKET 24POS GOLD |
2019 | 3.31 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
940-44-032-17-400004CONN SOCKET PLCC 32POS SMD |
2899 | 3.04 |
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Tape & Reel (TR) | 940 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | - | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) | |
|
|
110-83-428-41-105101CONN IC DIP SOCKET 28POS GOLD |
2438 | 3.14 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
04-0511-10CONN SOCKET SIP 4POS TIN |
3494 | 3.05 |
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Datenblatt |
Bulk | 511 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-308-T-PADAPTER PLUG |
2157 | 3.06 |
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Tube | APA | Active | - | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
10-6513-11CONN IC DIP SOCKET 10POS GOLD |
2300 | 3.07 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-0513-10TCONN SOCKET SIP 20POS GOLD |
3032 | 3.07 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 0513 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-3518-00CONN IC DIP SOCKET 18POS GOLD |
2259 | 3.07 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
26-1518-10CONN IC DIP SOCKET 26POS GOLD |
2198 | 3.07 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 26 (2 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
114-83-642-41-117101CONN IC DIP SOCKET 42POS GOLD |
2215 | 2.88 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
114-83-642-41-134161CONN IC DIP SOCKET 42POS GOLD |
2480 | 2.88 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
06-3518-11HCONN IC DIP SOCKET 6POS GOLD |
3754 | 3.08 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
117-93-316-41-005000CONN IC DIP SOCKET 16POS GOLD |
3329 | 3.08 |
Ajouter au panierDemander |
Datenblatt |
Tube | 117 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
13-0518-00CONN SOCKET SIP 13POS GOLD |
3386 | 3.09 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | SIP | 13 (1 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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