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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1051900001

1051900001

TOP-MOUNT CAMERA SOCKET FOR SMIA

Molex

2898 0.00
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1051900001

Datenblatt

Tape & Reel (TR) 105190 Obsolete Camera Socket 12 (2 x 6) 0.033 (0.85mm) Gold 12.0µin (0.30µm) Phosphor Bronze Alloy Surface Mount Open Frame Solder 0.033 (0.85mm) Gold Flash Phosphor Bronze Alloy Thermoplastic
1052000001

1052000001

SMIA55 CAMERA SOCKET BOTTOM CONT

Molex

2587 0.00
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1052000001

Datenblatt

Tray 105200 Obsolete Camera Socket 12 (2 x 6) 0.028 (0.70mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.028 (0.70mm) Gold Flash Copper Alloy Thermoplastic
1052000008

1052000008

SMIA55 CAMERA SOCKET BOTTOM CONT

Molex

2242 0.00
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1052000008

Datenblatt

Tray 105200 Obsolete Camera Socket 12 (2 x 6) 0.028 (0.70mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount, Through Board Open Frame Solder 0.028 (0.70mm) Gold Flash Copper Alloy Thermoplastic
0784990002

0784990002

CONN CAM SOCKET 24POS GOLD

Molex

3446 0.00
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0784990002

Datenblatt

Tape & Reel (TR) 78499 Obsolete Camera Socket 24 (2 x 4, 2 x 8) 0.024 (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024 (0.60mm) Gold Flash Copper Alloy Plastic
1051990001

1051990001

CONN CAM SOCKET 34POS GOLD

Molex

2507 0.00
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1051990001

Datenblatt

Tape & Reel (TR) 105199 Obsolete Camera Socket 34 (2 x 8, 2 x 9) 0.024 (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024 (0.60mm) - - Copper Alloy Plastic
510-AG92D-10

510-AG92D-10

CONN SOCKET SIP 10POS TIN-LEAD

TE Connectivity AMP Connectors

2195 0.00
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Bulk - Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin-Lead - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead - Beryllium Copper Thermoplastic
2-382712-1

2-382712-1

CONN IC DIP SOCKET 16POS TIN

TE Connectivity AMP Connectors

3453 0.00
- +

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Demander

2-382712-1

Datenblatt

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-382714-1

2-382714-1

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

2681 0.00
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Demander

2-382714-1

Datenblatt

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
2-382719-1

2-382719-1

CONN IC DIP SOCKET 30POS TIN

TE Connectivity AMP Connectors

3046 2.26
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Demander

2-382719-1

Datenblatt

Tube,Box Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled
1939416-1

1939416-1

CONN SOCKET LGA 1207POS GOLD

TE Connectivity AMP Connectors

3187 0.00
- +

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Demander

1939416-1

Datenblatt

Tray - Active LGA 1207 (33 x 34) 0.043 (1.09mm) Gold - Beryllium Copper Surface Mount Closed Frame Solder 0.043 (1.09mm) - - - Thermoplastic
1939416-2

1939416-2

CONN SOCKET LGA 1207POS GOLD

TE Connectivity AMP Connectors

2799 0.00
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Demander

1939416-2

Datenblatt

Tray - Active LGA 1207 (33 x 34) 0.043 (1.09mm) Gold - Beryllium Copper Surface Mount Closed Frame Solder 0.043 (1.09mm) - - - Thermoplastic
524-AG11D

524-AG11D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

2433 0.00
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Demander

524-AG11D

Datenblatt

Tube 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Polyester
814-AG11D

814-AG11D

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

3769 0.00
- +

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Demander

814-AG11D

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
814-AG11D-ES

814-AG11D-ES

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

3545 0.00
- +

Ajouter au panier

Demander

814-AG11D-ES

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
818-AG11D-ESL

818-AG11D-ESL

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

2420 0.00
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Demander

818-AG11D-ESL

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester
TDU02DXTB

TDU02DXTB

TEST SOCKET

Sullins Connector Solutions

3464 0.00
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Demander

Bulk - Active Axial 2 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Board Guide Solder 0.150 (3.81mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
2174988-1

2174988-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

2061 0.00
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Demander

2174988-1

Datenblatt

Bulk - Last Time Buy LGA 2011 (47 x 58) 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.035 (0.90mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
2040636-1

2040636-1

CONN SOCKET LGA 1567POS GOLD

TE Connectivity AMP Connectors

3912 83.92
- +

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Demander

2040636-1

Datenblatt

Tray,Box - Obsolete LGA 1567 0.040 (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039 (1.00mm) - - Copper Alloy Thermoplastic
2134146-2

2134146-2

CONN SOCKET PGA 989POS GOLD

TE Connectivity AMP Connectors

3379 9.37
- +

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2134146-2

Datenblatt

Tape & Reel (TR),Cut Tape (CT),Box - Obsolete PGA 989 (35 x 36) 0.157 (4.00mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.157 (4.00mm) Tin-Lead Flash Copper Alloy Thermoplastic
XR2C2611N

XR2C2611N

CONN SOCKET SIP 26POS GOLD

Omron Electronics Inc-EMC Div

3156 0.00
- +

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Demander

XR2C2611N

Datenblatt

Bulk XR2 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
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