Photos | Le fabricant# | Stocks | Prix | Quantité | Tableau | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
233-PGM18039-51CONN SOCKET PGA GOLD |
2061 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
256-PG16001-10HCONN SOCKET PGA GOLD |
3753 | 0.00 |
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Datenblatt |
Bulk | PG | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
257-PGM20012-10CONN SOCKET PGA GOLD |
2581 | 0.00 |
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Datenblatt |
Bulk | PGM | Obsolete | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-14CONN IC DIP SOCKET 14POS GOLD |
3645 | 0.00 |
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Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-16CONN IC DIP SOCKET 16POS GOLD |
2485 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-18CONN IC DIP SOCKET 18POS GOLD |
3490 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-20CONN IC DIP SOCKET 20POS GOLD |
3993 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-28CONN IC DIP SOCKET 28POS GOLD |
3496 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-10CONN IC DIP SOCKET 10POS GOLD |
3502 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-12CONN IC DIP SOCKET 12POS GOLD |
3023 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-22CONN IC DIP SOCKET 22POS GOLD |
2606 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-24CONN IC DIP SOCKET 24POS GOLD |
3964 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-26CONN IC DIP SOCKET 26POS GOLD |
2002 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 26 (2 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109800-8CONN IC DIP SOCKET 8POS GOLD |
2116 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Correct-A-Chip® 1109800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Programmable | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109681-308CONN IC DIP SOCKET 8POS GOLD |
2577 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109681-314CONN IC DIP SOCKET 14POS GOLD |
2534 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109681-316CONN IC DIP SOCKET 16POS GOLD |
2938 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109681-318CONN IC DIP SOCKET 28POS GOLD |
3089 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109681-320CONN IC DIP SOCKET 20POS GOLD |
2632 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
1109681-324CONN IC DIP SOCKET 24POS GOLD |
3893 | 0.00 |
Ajouter au panierDemander |
Datenblatt |
Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Spacer | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |