Photos | Le fabricant# | Stocks | Prix | Quantité | Tableau | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
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DILB16P-223TLFCONN IC DIP SOCKET 16POS TIN |
13302 | 0.62 |
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![]() Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
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4816-3000-CPCONN IC DIP SOCKET 16POS TIN |
20763 | 0.63 |
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![]() Datenblatt |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
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4808-3000-CPCONN IC DIP SOCKET 8POS TIN |
10438 | 0.63 |
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![]() Datenblatt |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
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4814-3000-CPCONN IC DIP SOCKET 14POS TIN |
8250 | 0.63 |
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![]() Datenblatt |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
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4814-3004-CPCONN IC DIP SOCKET 14POS TIN |
4063 | 0.63 |
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![]() Datenblatt |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
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A 40-LC-TTCONN IC DIP SOCKET 40POS TIN |
9653 | 0.64 |
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![]() Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
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AR 24-HZL-TTCONN IC DIP SOCKET 24POS TIN |
4933 | 0.64 |
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![]() Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
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110-87-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
11368 | 0.59 |
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![]() Datenblatt |
Tube | 110 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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XR2C-0311-NCONN SOCKET SIP 3POS GOLD |
2556 | 0.60 |
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![]() Datenblatt |
Bulk | XR2 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
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110-87-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
13496 | 0.59 |
Ajouter au panierDemander |
![]() Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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232-32-TRCONN SOCKET PLCC 32POS TIN |
6624 | 1.05 |
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![]() Datenblatt |
Tape & Reel (TR),Cut Tape (CT) | - | Active | PLCC | 32 (4 x 8) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled |
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SA143000CONN IC DIP SOCKET 14POS GOLD |
6676 | 0.73 |
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![]() Datenblatt |
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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SA143040CONN IC DIP SOCKET 14POS GOLD |
3233 | 0.75 |
Ajouter au panierDemander |
![]() Datenblatt |
Tube | SA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled |
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4816-3004-CPCONN IC DIP SOCKET 16POS TIN |
17629 | 0.76 |
Ajouter au panierDemander |
![]() Datenblatt |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
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4818-3000-CPCONN IC DIP SOCKET 18POS TIN |
2646 | 0.76 |
Ajouter au panierDemander |
![]() Datenblatt |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
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DILB20P-223TLFCONN IC DIP SOCKET 20POS TIN |
14385 | 0.78 |
Ajouter au panierDemander |
![]() Datenblatt |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
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1-2199298-8CONN IC DIP SOCKET 24POS TIN |
7343 | 0.78 |
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![]() Datenblatt |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
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245-32-1-06CONN IC DIP SOCKET 32POS TIN |
1303 | 0.78 |
Ajouter au panierDemander |
![]() Datenblatt |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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4818-3004-CPCONN IC DIP SOCKET 18POS TIN |
7644 | 0.79 |
Ajouter au panierDemander |
![]() Datenblatt |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
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4820-3004-CPCONN IC DIP SOCKET 20POS TIN |
1045 | 0.79 |
Ajouter au panierDemander |
![]() Datenblatt |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |