Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
110-87-306-41-001101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	18085	0.41	- + Ajouter au panier Demander	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 06-HZL/01-TT CONN IC DIP SOCKET 6POS GOLD Assmann WSW Components	6667	0.47	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
A 20-LC-TR CONN IC DIP SOCKET 20POS TIN Assmann WSW Components	3116	0.47	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
A 24-LC/7-T CONN IC DIP SOCKET 24POS TIN Assmann WSW Components	2300	0.47	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)
SA083040 CONN IC DIP SOCKET 8POS GOLD On Shore Technology Inc.	4690	0.47	- + Ajouter au panier Demander	Datenblatt	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled
A 28-LC-TR CONN IC DIP SOCKET 28POS TIN Assmann WSW Components	1406	0.47	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
ED40DT CONN IC DIP SOCKET 40POS TIN On Shore Technology Inc.	11060	0.48	- + Ajouter au panier Demander	Datenblatt	Tube	ED	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
SA083000 CONN IC DIP SOCKET 8POS GOLD On Shore Technology Inc.	6789	0.48	- + Ajouter au panier Demander	Datenblatt	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled
SA103000 CONN IC DIP SOCKET 10POS GOLD On Shore Technology Inc.	9722	0.52	- + Ajouter au panier Demander	Datenblatt	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled
A 32-LC-TT CONN IC DIP SOCKET 32POS TIN Assmann WSW Components	2676	0.52	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT)
ICM-308-1-GT-HT MACHINE PIN SOCKET, IC, DIP, 8P Adam Tech	1554	0.52	- + Ajouter au panier Demander	Datenblatt	Tube	ICM	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Polyphenylene Sulfide (PPS)
AR 08-HZL/01-TT CONN IC DIP SOCKET 8POS GOLD Assmann WSW Components	31861	0.54	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
DILB14P-223TLF CONN IC DIP SOCKET 14POS TIN Amphenol ICC (FCI)	4962	0.54	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon
A 22-LC-T2 CONN IC DIP SOCKET 22POS TIN Assmann WSW Components	1229	0.54	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT)
AR 20-HZL-TT CONN IC DIP SOCKET 20POS TIN Assmann WSW Components	3932	0.56	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
245-24-1-06 CONN IC DIP SOCKET 24POS TIN CNC Tech	1370	0.58	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole, Kinked Pin	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
1-2199298-6 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	6422	0.59	- + Ajouter au panier Demander	Datenblatt	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
110-44-308-41-001000 CONN IC DIP SOCKET 8POS TIN Mill-Max Manufacturing Corp.	4466	0.61	- + Ajouter au panier Demander	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-308-41-001000 CONN IC DIP SOCKET 8POS TIN-LEAD Mill-Max Manufacturing Corp.	1153	0.61	- + Ajouter au panier Demander	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
243-32-1-06 CONN IC DIP SOCKET 32POS TIN CNC Tech	1229	0.61	- + Ajouter au panier Demander	Datenblatt	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled

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