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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-441-21-000001

510-13-441-21-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2090 90.46
- +

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510-13-441-21-000001

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Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-441-21-000002

510-13-441-21-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3244 90.46
- +

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510-13-441-21-000002

Datenblatt

Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-441-21-000003

510-13-441-21-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3949 90.46
- +

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510-13-441-21-000003

Datenblatt

Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-PLS13121-12

121-PLS13121-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2015 91.58
- +

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121-PLS13121-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
121-PRS13121-12

121-PRS13121-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2226 91.58
- +

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121-PRS13121-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
24-3552-18

24-3552-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3086 91.79
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
24-3553-18

24-3553-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2750 91.79
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
24-6551-18

24-6551-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2492 91.79
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
24-6552-18

24-6552-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2211 91.79
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
24-6553-18

24-6553-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3578 91.79
- +

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Demander

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
24-3554-18

24-3554-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3257 91.79
- +

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Demander

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
24-6554-18

24-6554-18

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3553 91.79
- +

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Demander

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
132-PLS14016-12

132-PLS14016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3993 92.03
- +

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Demander

132-PLS14016-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PLS17048-12

100-PLS17048-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3304 92.70
- +

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Demander

100-PLS17048-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PLS17049-12

100-PLS17049-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2542 92.70
- +

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Demander

100-PLS17049-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PRS17048-12

100-PRS17048-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2798 92.70
- +

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Demander

100-PRS17048-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
100-PRS17049-12

100-PRS17049-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2366 92.70
- +

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Demander

100-PRS17049-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
144-PLS15026-12

144-PLS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3436 94.14
- +

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Demander

144-PLS15026-12

Datenblatt

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
144-PRS15026-12

144-PRS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2081 94.14
- +

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Demander

144-PRS15026-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
145-PRS15058-12

145-PRS15058-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2098 94.26
- +

Ajouter au panier

Demander

145-PRS15058-12

Datenblatt

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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