English
Deutsch
Русский
Türkiye
Français
| Photos | Le fabricant# | Stocks | Prix | Quantité | Tableau | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
28-6501-30CONN IC DIP SOCKET 28POS TIN |
3326 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-6501-20CONN IC DIP SOCKET 28POS TIN |
3604 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-71187-10CONN SOCKET SIP 6POS TIN |
2040 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-7360-10CONN SOCKET SIP 6POS TIN |
3390 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-7425-10CONN SOCKET SIP 6POS TIN |
2829 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-7755-10CONN SOCKET SIP 6POS TIN |
3974 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-3513-11CONN IC DIP SOCKET 28POS GOLD |
3384 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
64-9513-10TCONN IC DIP SOCKET 64POS GOLD |
3000 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6518-11HCONN IC DIP SOCKET 24POS GOLD |
2845 | 9.73 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-87-280-19-081101CONN SOCKET PGA 280POS GOLD |
3228 | 9.19 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 510 | Active | PGA | 280 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-281-19-081101CONN SOCKET PGA 281POS GOLD |
3603 | 9.22 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
.JPG)
|
123-13-640-41-001000CONN IC DIP SOCKET 40POS GOLD |
2331 | 9.75 |
Ajouter au panierDemander |
Datenblatt |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
10-3503-21CONN IC DIP SOCKET 10POS GOLD |
2846 | 9.75 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-3503-31CONN IC DIP SOCKET 10POS GOLD |
3237 | 9.75 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
11-0508-21CONN SOCKET SIP 11POS GOLD |
3645 | 9.78 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 508 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
11-0508-31CONN SOCKET SIP 11POS GOLD |
2516 | 9.78 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 508 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
12-81250-310CCONN IC DIP SOCKET 12POS GOLD |
3644 | 9.78 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-8312-310CCONN IC DIP SOCKET 12POS GOLD |
2671 | 9.78 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-8355-310CCONN IC DIP SOCKET 12POS GOLD |
2424 | 9.78 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-8358-310CCONN IC DIP SOCKET 12POS GOLD |
2105 | 9.78 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
Demander un devis
