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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
05-7350-10

05-7350-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

2250 9.31
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05-7350-10

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Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7380-10

05-7380-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

3265 9.31
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05-7380-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7500-10

05-7500-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

3576 9.31
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05-7500-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7560-10

05-7560-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

2085 9.31
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05-7560-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7650-10

05-7650-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

3697 9.31
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05-7650-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7880-10

05-7880-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

2232 9.31
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05-7880-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
33-0518-11H

33-0518-11H

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2067 9.31
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33-0518-11H

Datenblatt

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-151-41-013000

346-93-151-41-013000

CONN SOCKET SIP 51POS GOLD

Mill-Max Manufacturing Corp.

3637 9.33
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346-93-151-41-013000

Datenblatt

Bulk 346 Active SIP 51 (1 x 51) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-151-41-013000

346-43-151-41-013000

CONN SOCKET SIP 51POS GOLD

Mill-Max Manufacturing Corp.

3987 9.33
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346-43-151-41-013000

Datenblatt

Bulk 346 Active SIP 51 (1 x 51) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-C195-00

14-C195-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3022 9.33
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14-C195-00

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C280-00

14-C280-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3149 9.33
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14-C280-00

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-820-90TWR

14-820-90TWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2681 9.33
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14-820-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
299-43-626-10-002000

299-43-626-10-002000

CONN IC DIP SOCKET 26POS GOLD

Mill-Max Manufacturing Corp.

3956 9.35
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299-43-626-10-002000

Datenblatt

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6518-10H

40-6518-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3739 9.36
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40-6518-10H

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-0518-00

38-0518-00

CONN SOCKET SIP 38POS GOLD

Aries Electronics

2826 9.36
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38-0518-00

Datenblatt

Bulk 518 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-1518-00

38-1518-00

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2913 9.36
- +

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38-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0517-90C

22-0517-90C

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2086 9.36
- +

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22-0517-90C

Datenblatt

Bulk 0517 Active SIP 22 (1 x 22) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-640-T-A

APA-640-T-A

ADAPTER PLUG

Samtec Inc.

3691 9.37
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Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
36-0511-10

36-0511-10

CONN SOCKET SIP 36POS TIN

Aries Electronics

2197 9.40
- +

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36-0511-10

Datenblatt

Bulk 511 Active SIP 36 (1 x 36) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-9513-10H

20-9513-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3914 9.40
- +

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20-9513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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