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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-176-16-001101

510-83-176-16-001101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

3179 8.16
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510-83-176-16-001101

Datenblatt

Bulk 510 Active PGA 176 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-176-16-071101

510-83-176-16-071101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

2134 8.16
- +

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Demander

510-83-176-16-071101

Datenblatt

Bulk 510 Active PGA 176 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-11-304-41-001000

122-11-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3133 8.55
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122-11-304-41-001000

Datenblatt

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-80-084-10-031101

550-80-084-10-031101

PGA SOLDER TAIL

Preci-Dip

3262 8.20
- +

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550-80-084-10-031101

Datenblatt

Bulk 550 Active PGA 84 (10 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-177-15-061101

510-83-177-15-061101

CONN SOCKET PGA 177POS GOLD

Preci-Dip

2913 8.21
- +

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510-83-177-15-061101

Datenblatt

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
35-0518-00

35-0518-00

CONN SOCKET SIP 35POS GOLD

Aries Electronics

2778 8.58
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Demander

35-0518-00

Datenblatt

Bulk 518 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-304-41-001000

612-13-304-41-001000

SOCKET CARRIER SLDRTL .300 4POS

Mill-Max Manufacturing Corp.

3150 8.58
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Demander

612-13-304-41-001000

Datenblatt

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-147-41-013000

346-93-147-41-013000

CONN SOCKET SIP 47POS GOLD

Mill-Max Manufacturing Corp.

3417 8.60
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Demander

346-93-147-41-013000

Datenblatt

Bulk 346 Active SIP 47 (1 x 47) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-147-41-013000

346-43-147-41-013000

CONN SOCKET SIP 47POS GOLD

Mill-Max Manufacturing Corp.

3635 8.60
- +

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Demander

346-43-147-41-013000

Datenblatt

Bulk 346 Active SIP 47 (1 x 47) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-304-41-002000

124-93-304-41-002000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

3922 8.62
- +

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Demander

124-93-304-41-002000

Datenblatt

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
10-8550-610C

10-8550-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2707 8.69
- +

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Demander

10-8550-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8563-610C

10-8563-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3768 8.69
- +

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Demander

10-8563-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8750-610C

10-8750-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2717 8.69
- +

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Demander

10-8750-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8937-610C

10-8937-610C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2284 8.69
- +

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Demander

10-8937-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
124-43-304-41-002000

124-43-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3268 8.62
- +

Ajouter au panier

Demander

124-43-304-41-002000

Datenblatt

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-320-T-B

APA-320-T-B

ADAPTER PLUG

Samtec Inc.

3490 8.62
- +

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Demander

Bulk APA Active - 20 (2 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
714-43-132-31-018000

714-43-132-31-018000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

3644 8.65
- +

Ajouter au panier

Demander

714-43-132-31-018000

Datenblatt

Tube 714 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-648-41-001000

123-93-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3749 8.66
- +

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Demander

123-93-648-41-001000

Datenblatt

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-0511-10

30-0511-10

CONN SOCKET SIP 30POS TIN

Aries Electronics

3815 8.67
- +

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Demander

30-0511-10

Datenblatt

Bulk 511 Active SIP 30 (1 x 30) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-3508-21

06-3508-21

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3826 8.67
- +

Ajouter au panier

Demander

06-3508-21

Datenblatt

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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