Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
10-8375-310C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	2522	8.47	- + Ajouter au panier Demander	Datenblatt	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-8575-310C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3440	8.47	- + Ajouter au panier Demander	Datenblatt	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-8620-310C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3634	8.47	- + Ajouter au panier Demander	Datenblatt	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
10-8630-310C CONN IC DIP SOCKET 10POS GOLD Aries Electronics	3851	8.47	- + Ajouter au panier Demander	Datenblatt	Bulk	8	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
ICO-628-MGT CONN IC DIP SOCKET 28POS GOLD Samtec Inc.	2354	8.49	- + Ajouter au panier Demander	Datenblatt	Tube	ICO	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
510-83-174-17-061101 CONN SOCKET PGA 174POS GOLD Preci-Dip	2216	8.07	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	174 (17 x 17)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-174-17-081101 CONN SOCKET PGA 174POS GOLD Preci-Dip	2019	8.07	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	174 (17 x 17)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-6411-N I.C. CONNECTOR SOCKET Omron Electronics Inc-EMC Div	3447	8.50	- + Ajouter au panier Demander		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
06-0501-21 CONN SOCKET SIP 6POS GOLD Aries Electronics	3177	8.51	- + Ajouter au panier Demander	Datenblatt	Bulk	501	Active	SIP	6 (1 x 6)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
06-0501-31 CONN SOCKET SIP 6POS GOLD Aries Electronics	3545	8.51	- + Ajouter au panier Demander	Datenblatt	Bulk	501	Active	SIP	6 (1 x 6)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
15-0503-20 CONN SOCKET SIP 15POS GOLD Aries Electronics	2195	8.51	- + Ajouter au panier Demander	Datenblatt	Bulk	0503	Active	SIP	15 (1 x 15)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA), Nylon, Glass Filled
15-0503-30 CONN SOCKET SIP 15POS GOLD Aries Electronics	2340	8.51	- + Ajouter au panier Demander	Datenblatt	Bulk	0503	Active	SIP	15 (1 x 15)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA), Nylon, Glass Filled
514-83-078-13-061117 CONN SOCKET PGA 78POS GOLD Preci-Dip	3115	8.08	- + Ajouter au panier Demander	Datenblatt	Bulk	514	Active	PGA	78 (13 x 13)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-004101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	2555	8.09	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-4518-11H CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3431	8.53	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-0517-90C CONN SOCKET SIP 20POS GOLD Aries Electronics	3489	8.53	- + Ajouter au panier Demander	Datenblatt	Bulk	0517	Active	SIP	20 (1 x 20)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-175-16-072101 CONN SOCKET PGA 175POS GOLD Preci-Dip	3153	8.12	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	175 (16 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-013101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3298	8.12	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-630-10-002101 CONN IC DIP SOCKET 30POS GOLD Preci-Dip	3029	8.15	- + Ajouter au panier Demander	Datenblatt	Bulk	299	Active	DIP, 0.6 (15.24mm) Row Spacing	30 (2 x 15)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-176-15-061101 CONN SOCKET PGA 176POS GOLD Preci-Dip	3253	8.16	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	176 (15 x 15)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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