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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-6503-20

14-6503-20

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3023 7.71
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14-6503-20

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-6503-30

14-6503-30

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2999 7.71
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14-6503-30

Datenblatt

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
104-11-304-41-780000

104-11-304-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3929 7.72
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104-11-304-41-780000

Datenblatt

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-650-41-011101

116-83-650-41-011101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2647 8.21
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116-83-650-41-011101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-149-15-061101

510-83-149-15-061101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

3448 7.36
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510-83-149-15-061101

Datenblatt

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-149-15-063101

510-83-149-15-063101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

3298 7.36
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510-83-149-15-063101

Datenblatt

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-149-15-064101

510-83-149-15-064101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

2147 7.36
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510-83-149-15-064101

Datenblatt

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
13-0503-20

13-0503-20

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2840 7.76
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13-0503-20

Datenblatt

Bulk 0503 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
13-0503-30

13-0503-30

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3761 7.76
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13-0503-30

Datenblatt

Bulk 0503 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
08-2810-90T

08-2810-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2285 7.76
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08-2810-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-6518-10M

28-6518-10M

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2141 7.76
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28-6518-10M

Datenblatt

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0511-10

34-0511-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

3850 7.78
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34-0511-10

Datenblatt

Bulk 511 Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-3501-30WR

20-3501-30WR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2826 7.78
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20-3501-30WR

Datenblatt

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-10

32-C300-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2582 7.78
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32-C300-10

Datenblatt

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
126-93-304-41-002000

126-93-304-41-002000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2431 7.78
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126-93-304-41-002000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-304-41-002000

126-43-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2409 7.78
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126-43-304-41-002000

Datenblatt

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
17-0511-10

17-0511-10

CONN SOCKET SIP 17POS TIN

Aries Electronics

2751 7.78
- +

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17-0511-10

Datenblatt

Bulk 511 Active SIP 17 (1 x 17) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-11H

24-0513-11H

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2528 7.78
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24-0513-11H

Datenblatt

Bulk 0513 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0513-11H

25-0513-11H

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2387 7.78
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25-0513-11H

Datenblatt

Bulk 0513 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0508-20

16-0508-20

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2352 7.78
- +

Ajouter au panier

Demander

16-0508-20

Datenblatt

Bulk 508 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
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