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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-43-304-41-003000

116-43-304-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3126 7.63
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116-43-304-41-003000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-068-10-061112

614-87-068-10-061112

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2749 7.20
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614-87-068-10-061112

Datenblatt

Bulk 614 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-43-448-41-005000

117-43-448-41-005000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3956 7.64
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117-43-448-41-005000

Datenblatt

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 48 (2 x 24) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-140-41-013000

346-93-140-41-013000

CONN SOCKET SIP 40POS GOLD

Mill-Max Manufacturing Corp.

2369 7.64
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346-93-140-41-013000

Datenblatt

Bulk 346 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-140-41-013000

346-43-140-41-013000

CONN SOCKET SIP 40POS GOLD

Mill-Max Manufacturing Corp.

3596 7.64
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346-43-140-41-013000

Datenblatt

Bulk 346 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
05-0501-20

05-0501-20

CONN SOCKET SIP 5POS TIN

Aries Electronics

2874 7.64
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05-0501-20

Datenblatt

Bulk 501 Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-0501-30

05-0501-30

CONN SOCKET SIP 5POS TIN

Aries Electronics

3583 7.64
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05-0501-30

Datenblatt

Bulk 501 Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6820-90TWR

10-6820-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3290 7.64
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10-6820-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
10-6822-90TWR

10-6822-90TWR

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3704 7.64
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10-6822-90TWR

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
110-13-964-41-001000

110-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

2649 7.66
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110-13-964-41-001000

Datenblatt

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-0518-00

30-0518-00

CONN SOCKET SIP 30POS GOLD

Aries Electronics

2134 7.67
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30-0518-00

Datenblatt

Bulk 518 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-1518-00

30-1518-00

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2724 7.67
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30-1518-00

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-81250-610C

08-81250-610C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3216 7.67
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08-81250-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-8305-610C

08-8305-610C

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3909 7.67
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08-8305-610C

Datenblatt

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-0511-10

16-0511-10

CONN SOCKET SIP 16POS TIN

Aries Electronics

3897 7.67
- +

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Demander

16-0511-10

Datenblatt

Bulk 511 Active SIP 16 (1 x 16) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-41-304-41-007000

116-41-304-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3757 7.68
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Demander

116-41-304-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-304-41-007000

116-91-304-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3095 7.68
- +

Ajouter au panier

Demander

116-91-304-41-007000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-6501-20

16-6501-20

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2203 7.69
- +

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Demander

16-6501-20

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6501-30

16-6501-30

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3728 7.69
- +

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Demander

16-6501-30

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-11H

26-0518-11H

CONN SOCKET SIP 26POS GOLD

Aries Electronics

2035 7.69
- +

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Demander

26-0518-11H

Datenblatt

Bulk 518 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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