English
Deutsch
Русский
Türkiye
Français
| Photos | Le fabricant# | Stocks | Prix | Quantité | Tableau | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
28-3518-101CONN IC DIP SOCKET 28POS GOLD |
3409 | 6.62 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
28-6518-101CONN IC DIP SOCKET 28POS GOLD |
3918 | 6.62 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
08-2820-90CCONN IC DIP SOCKET 8POS GOLD |
3363 | 6.62 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-2822-90CCONN IC DIP SOCKET 8POS GOLD |
3062 | 6.62 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-2823-90CCONN IC DIP SOCKET 8POS GOLD |
3222 | 6.62 |
Ajouter au panierDemander |
Datenblatt |
Bulk | Vertisockets™ 800 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-628-T-A1ADAPTER PLUG |
2923 | 6.63 |
Ajouter au panierDemander |
Bulk | APA | Active | - | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
38-1518-11CONN IC DIP SOCKET 38POS GOLD |
2950 | 6.64 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 38 (2 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-320-T-NADAPTER PLUG |
3980 | 6.65 |
Ajouter au panierDemander |
Tube | APA | Active | - | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
110-11-304-41-001000CONN IC SKT DBL |
3049 | 6.67 |
Ajouter au panierDemander |
Datenblatt |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
]-1xx-41-013000.jpg)
|
346-93-135-41-013000CONN SOCKET SIP 35POS GOLD |
3305 | 6.68 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 346 | Active | SIP | 35 (1 x 35) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
38-0518-11CONN SOCKET SIP 38POS GOLD |
3377 | 6.69 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-C195-11CONN IC DIP SOCKET 16POS GOLD |
2970 | 6.69 |
Ajouter au panierDemander |
Datenblatt |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-C280-11CONN IC DIP SOCKET 16POS GOLD |
2718 | 6.69 |
Ajouter au panierDemander |
Datenblatt |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-C212-10CONN IC DIP SOCKET 24POS GOLD |
2683 | 6.69 |
Ajouter au panierDemander |
Datenblatt |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-C300-10CONN IC DIP SOCKET 24POS GOLD |
3260 | 6.69 |
Ajouter au panierDemander |
Datenblatt |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-3518-101HCONN IC DIP SOCKET 24POS GOLD |
2250 | 6.69 |
Ajouter au panierDemander |
Datenblatt |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-C195-10HCONN IC DIP SOCKET 16POS GOLD |
3469 | 6.71 |
Ajouter au panierDemander |
Datenblatt |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
XR2T2421NCONN IC DIP SOCKET 24POS GOLD |
2597 | 6.72 |
Ajouter au panierDemander |
Datenblatt |
Bulk | XR2 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Threaded | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
114-93-304-41-117000CONN IC DIP SOCKET 4POS GOLD |
2577 | 6.73 |
Ajouter au panierDemander |
Datenblatt |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-43-304-41-117000CONN IC SKT DBL |
3094 | 6.73 |
Ajouter au panierDemander |
Datenblatt |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Demander un devis
