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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
346-93-134-41-013000

346-93-134-41-013000

CONN SOCKET SIP 34POS GOLD

Mill-Max Manufacturing Corp.

2713 6.49
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346-93-134-41-013000

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Bulk 346 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-134-41-013000

346-43-134-41-013000

CONN SOCKET SIP 34POS GOLD

Mill-Max Manufacturing Corp.

3633 6.49
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346-43-134-41-013000

Datenblatt

Bulk 346 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-123-31-018000

714-43-123-31-018000

CONN SOCKET SIP 23POS GOLD

Mill-Max Manufacturing Corp.

2027 6.49
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714-43-123-31-018000

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Bulk 714 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-068-11-061135

546-87-068-11-061135

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3238 6.14
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546-87-068-11-061135

Datenblatt

Bulk 546 Active PGA 68 (11 x 11) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-068-11-061136

546-87-068-11-061136

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2106 6.14
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546-87-068-11-061136

Datenblatt

Bulk 546 Active PGA 68 (11 x 11) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-132-13-001101

510-83-132-13-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

2817 6.12
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510-83-132-13-001101

Datenblatt

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-011101

116-83-642-41-011101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3768 6.15
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Demander

116-83-642-41-011101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-009101

116-83-650-41-009101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2388 6.90
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Demander

116-83-650-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-47-304-41-001000

110-47-304-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2637 6.50
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110-47-304-41-001000

Datenblatt

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-0513-11H

20-0513-11H

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2020 6.50
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20-0513-11H

Datenblatt

Bulk 0513 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-11

24-0513-11

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2188 6.50
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Demander

24-0513-11

Datenblatt

Bulk 0513 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0513-11

25-0513-11

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2882 6.50
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Demander

25-0513-11

Datenblatt

Bulk 0513 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
37-0518-11

37-0518-11

CONN SOCKET SIP 37POS GOLD

Aries Electronics

3846 6.50
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Demander

37-0518-11

Datenblatt

Bulk 518 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0511-10

09-0511-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

2583 6.50
- +

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Demander

09-0511-10

Datenblatt

Bulk 511 Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
299-93-318-10-001000

299-93-318-10-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3378 6.51
- +

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Demander

299-93-318-10-001000

Datenblatt

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-318-10-001000

299-43-318-10-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3139 6.51
- +

Ajouter au panier

Demander

299-43-318-10-001000

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-210-17-061101

510-87-210-17-061101

CONN SOCKET PGA 210POS GOLD

Preci-Dip

3561 6.15
- +

Ajouter au panier

Demander

510-87-210-17-061101

Datenblatt

Bulk 510 Active PGA 210 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-6501-21

08-6501-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2390 6.52
- +

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Demander

08-6501-21

Datenblatt

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-133-13-001101

510-83-133-13-001101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

3268 6.17
- +

Ajouter au panier

Demander

510-83-133-13-001101

Datenblatt

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-133-13-002101

510-83-133-13-002101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

3170 6.17
- +

Ajouter au panier

Demander

510-83-133-13-002101

Datenblatt

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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