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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-87-664-41-105101

117-87-664-41-105101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2724 4.62
- +

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Demander

117-87-664-41-105101

Datenblatt

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-652-31-012101

614-83-652-31-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2801 4.63
- +

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Demander

614-83-652-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-952-31-012101

614-83-952-31-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3831 4.92
- +

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Demander

614-83-952-31-012101

Datenblatt

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-2025

XR2A-2025

CONN IC DIP SOCKET 20POS GOLD

Omron Electronics Inc-EMC Div

2752 4.90
- +

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Demander

XR2A-2025

Datenblatt

Bulk XR2 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
510-83-097-14-091101

510-83-097-14-091101

CONN SOCKET PGA 97POS GOLD

Preci-Dip

2267 4.93
- +

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Demander

510-83-097-14-091101

Datenblatt

Bulk 510 Active PGA 97 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-44-028-17-400004

540-44-028-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

3081 4.94
- +

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Demander

540-44-028-17-400004

Datenblatt

Tape & Reel (TR) 540 Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 100.0µin (2.54µm) - Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS)
117-43-628-41-005000

117-43-628-41-005000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3788 4.96
- +

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Demander

117-43-628-41-005000

Datenblatt

Tube 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-125-41-013000

346-93-125-41-013000

CONN SOCKET SIP 25POS GOLD

Mill-Max Manufacturing Corp.

2602 4.97
- +

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Demander

346-93-125-41-013000

Datenblatt

Bulk 346 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-125-41-013000

346-43-125-41-013000

CONN SOCKET SIP 25POS GOLD

Mill-Max Manufacturing Corp.

3766 4.97
- +

Ajouter au panier

Demander

346-43-125-41-013000

Datenblatt

Bulk 346 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-648-41-003000

115-93-648-41-003000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3024 4.97
- +

Ajouter au panier

Demander

115-93-648-41-003000

Datenblatt

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
XR2A2201N

XR2A2201N

CONN IC DIP SOCKET 22POS GOLD

Omron Electronics Inc-EMC Div

3821 4.97
- +

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Demander

XR2A2201N

Datenblatt

Bulk XR2 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
116-83-652-41-003101

116-83-652-41-003101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2034 4.99
- +

Ajouter au panier

Demander

116-83-652-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-117-31-018000

714-43-117-31-018000

CONN SOCKET SIP 17POS GOLD

Mill-Max Manufacturing Corp.

2705 4.99
- +

Ajouter au panier

Demander

714-43-117-31-018000

Datenblatt

Bulk 714 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-156-15-061101

510-87-156-15-061101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

3426 4.70
- +

Ajouter au panier

Demander

510-87-156-15-061101

Datenblatt

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-156-15-062101

510-87-156-15-062101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

3013 4.70
- +

Ajouter au panier

Demander

510-87-156-15-062101

Datenblatt

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-156-16-091101

510-87-156-16-091101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

2788 4.70
- +

Ajouter au panier

Demander

510-87-156-16-091101

Datenblatt

Bulk 510 Active PGA 156 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-652-41-035101

146-87-652-41-035101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2900 4.70
- +

Ajouter au panier

Demander

146-87-652-41-035101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-652-41-036101

146-87-652-41-036101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2137 4.70
- +

Ajouter au panier

Demander

146-87-652-41-036101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-008101

116-87-650-41-008101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3985 5.27
- +

Ajouter au panier

Demander

116-87-650-41-008101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-156-16-001101

510-87-156-16-001101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

3513 4.70
- +

Ajouter au panier

Demander

510-87-156-16-001101

Datenblatt

Bulk 510 Active PGA 156 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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