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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-149-15-003101

510-87-149-15-003101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

2611 4.49
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Demander

510-87-149-15-003101

Datenblatt

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-149-15-061101

510-87-149-15-061101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

2610 4.49
- +

Ajouter au panier

Demander

510-87-149-15-061101

Datenblatt

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-149-15-063101

510-87-149-15-063101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

3215 4.49
- +

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Demander

510-87-149-15-063101

Datenblatt

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-149-15-064101

510-87-149-15-064101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

2248 4.49
- +

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Demander

510-87-149-15-064101

Datenblatt

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-642-41-001101

122-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3593 4.49
- +

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Demander

122-83-642-41-001101

Datenblatt

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-642-41-001101

123-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3221 4.49
- +

Ajouter au panier

Demander

123-83-642-41-001101

Datenblatt

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-044-08-031112

614-87-044-08-031112

CONN SOCKET PGA 44POS GOLD

Preci-Dip

3327 4.50
- +

Ajouter au panier

Demander

614-87-044-08-031112

Datenblatt

Bulk 614 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
5-1571552-2

5-1571552-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

2475 4.77
- +

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Demander

5-1571552-2

Datenblatt

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
346-93-124-41-013000

346-93-124-41-013000

CONN SOCKET SIP 24POS GOLD

Mill-Max Manufacturing Corp.

2971 4.77
- +

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Demander

346-93-124-41-013000

Datenblatt

Tube 346 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-124-41-013000

346-43-124-41-013000

CONN SOCKET SIP 24POS GOLD

Mill-Max Manufacturing Corp.

2873 4.77
- +

Ajouter au panier

Demander

346-43-124-41-013000

Datenblatt

Bulk 346 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-6511-10

16-6511-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3455 4.78
- +

Ajouter au panier

Demander

16-6511-10

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-650-41-003101

116-83-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2653 4.80
- +

Ajouter au panier

Demander

116-83-650-41-003101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-650-41-035101

146-87-650-41-035101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2901 4.52
- +

Ajouter au panier

Demander

146-87-650-41-035101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-650-41-036101

146-87-650-41-036101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2546 4.52
- +

Ajouter au panier

Demander

146-87-650-41-036101

Datenblatt

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
24-6511-10

24-6511-10

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

2027 4.79
- +

Ajouter au panier

Demander

24-6511-10

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-624-41-004101

116-83-624-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2497 4.54
- +

Ajouter au panier

Demander

116-83-624-41-004101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-007101

116-83-640-41-007101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2406 4.54
- +

Ajouter au panier

Demander

116-83-640-41-007101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-160-13-001101

510-87-160-13-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

2536 4.54
- +

Ajouter au panier

Demander

510-87-160-13-001101

Datenblatt

Bulk 510 Active PGA 160 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-160-14-001101

510-87-160-14-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

3464 4.82
- +

Ajouter au panier

Demander

510-87-160-14-001101

Datenblatt

Bulk 510 Active PGA 160 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-011101

116-83-432-41-011101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3710 4.83
- +

Ajouter au panier

Demander

116-83-432-41-011101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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