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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-432-41-008101

116-87-432-41-008101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3864 3.02
- +

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Demander

116-87-432-41-008101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-002101

116-83-328-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3158 3.31
- +

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Demander

116-83-328-41-002101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-001101

116-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2195 3.02
- +

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Demander

116-83-324-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-001101

116-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3504 3.31
- +

Ajouter au panier

Demander

116-83-424-41-001101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-006101

116-87-648-41-006101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2935 3.12
- +

Ajouter au panier

Demander

116-87-648-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-0513-11H

10-0513-11H

CONN SOCKET SIP 10POS GOLD

Aries Electronics

2161 3.22
- +

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Demander

10-0513-11H

Datenblatt

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0513-11

12-0513-11

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2002 3.22
- +

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Demander

12-0513-11

Datenblatt

Bulk 0513 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0518-10H

23-0518-10H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3526 3.22
- +

Ajouter au panier

Demander

23-0518-10H

Datenblatt

Bulk 518 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-100-13-061101

510-87-100-13-061101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3625 3.02
- +

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Demander

510-87-100-13-061101

Datenblatt

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-100-13-062101

510-87-100-13-062101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3548 3.02
- +

Ajouter au panier

Demander

510-87-100-13-062101

Datenblatt

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-011101

116-83-322-41-011101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2865 3.03
- +

Ajouter au panier

Demander

116-83-322-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-111-31-018000

714-43-111-31-018000

CONN SOCKET SIP 11POS GOLD

Mill-Max Manufacturing Corp.

3678 3.23
- +

Ajouter au panier

Demander

714-43-111-31-018000

Datenblatt

Tube 714 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-87-650-41-001101

612-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3797 3.12
- +

Ajouter au panier

Demander

612-87-650-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-652-41-001101

110-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3953 3.04
- +

Ajouter au panier

Demander

110-83-652-41-001101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-952-41-001101

110-83-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2370 3.13
- +

Ajouter au panier

Demander

110-83-952-41-001101

Datenblatt

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-632-41-001101

122-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3994 3.04
- +

Ajouter au panier

Demander

122-87-632-41-001101

Datenblatt

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-632-41-001101

123-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2860 3.04
- +

Ajouter au panier

Demander

123-87-632-41-001101

Datenblatt

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-210-31-018000

714-43-210-31-018000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2318 3.24
- +

Ajouter au panier

Demander

714-43-210-31-018000

Datenblatt

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-83-424-41-009101

116-83-424-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3011 3.04
- +

Ajouter au panier

Demander

116-83-424-41-009101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-009101

116-83-624-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2100 3.04
- +

Ajouter au panier

Demander

116-83-624-41-009101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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