Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
115-87-636-41-003101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	2202	1.73	- + Ajouter au panier Demander	Datenblatt	Bulk	115	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-004101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	3325	1.48	- + Ajouter au panier Demander	Datenblatt	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-420-41-105101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	2021	1.48	- + Ajouter au panier Demander	Datenblatt	Bulk	110	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-624-31-012101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	2127	1.48	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-308-10-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	2576	1.48	- + Ajouter au panier Demander	Datenblatt	Bulk	299	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-422-41-001101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	2496	1.48	- + Ajouter au panier Demander	Datenblatt	Bulk	612	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-801101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	2755	1.48	- + Ajouter au panier Demander	Datenblatt	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-007101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	2286	1.49	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-007101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	3164	1.59	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-006101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	2961	1.59	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3518-10T CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3313	1.58	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-312-41-011101 CONN IC DIP SOCKET 12POS GOLD Preci-Dip	3684	1.54	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	12 (2 x 6)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-056-09-041101 CONN SOCKET PGA 56POS GOLD Preci-Dip	2480	1.49	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	56 (9 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-322-41-001101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	3350	1.50	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-636-41-117101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3307	1.75	- + Ajouter au panier Demander	Datenblatt	Bulk	114	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	2485	1.50	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-41-005101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2504	1.50	- + Ajouter au panier Demander	Datenblatt	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-008101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	3065	1.50	- + Ajouter au panier Demander	Datenblatt	Tube	116	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-328-41-001101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3812	1.50	- + Ajouter au panier Demander	Datenblatt	Bulk	612	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-628-41-001101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3865	1.75	- + Ajouter au panier Demander	Datenblatt	Bulk	612	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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