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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-87-636-41-003101

115-87-636-41-003101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2202 1.73
- +

Ajouter au panier

Demander

115-87-636-41-003101

Datenblatt

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-004101

116-87-312-41-004101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3325 1.48
- +

Ajouter au panier

Demander

116-87-312-41-004101

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-420-41-105101

110-83-420-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2021 1.48
- +

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Demander

110-83-420-41-105101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-624-31-012101

614-87-624-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2127 1.48
- +

Ajouter au panier

Demander

614-87-624-31-012101

Datenblatt

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-308-10-001101

299-83-308-10-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2576 1.48
- +

Ajouter au panier

Demander

299-83-308-10-001101

Datenblatt

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-422-41-001101

612-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2496 1.48
- +

Ajouter au panier

Demander

612-87-422-41-001101

Datenblatt

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-801101

110-83-314-41-801101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2755 1.48
- +

Ajouter au panier

Demander

110-83-314-41-801101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-007101

116-87-320-41-007101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2286 1.49
- +

Ajouter au panier

Demander

116-87-320-41-007101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-007101

116-87-420-41-007101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3164 1.59
- +

Ajouter au panier

Demander

116-87-420-41-007101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-420-41-006101

116-83-420-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2961 1.59
- +

Ajouter au panier

Demander

116-83-420-41-006101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3518-10T

20-3518-10T

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3313 1.58
- +

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Demander

20-3518-10T

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-312-41-011101

116-83-312-41-011101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3684 1.54
- +

Ajouter au panier

Demander

116-83-312-41-011101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-056-09-041101

510-87-056-09-041101

CONN SOCKET PGA 56POS GOLD

Preci-Dip

2480 1.49
- +

Ajouter au panier

Demander

510-87-056-09-041101

Datenblatt

Bulk 510 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-322-41-001101

614-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3350 1.50
- +

Ajouter au panier

Demander

614-83-322-41-001101

Datenblatt

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-636-41-117101

114-87-636-41-117101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3307 1.75
- +

Ajouter au panier

Demander

114-87-636-41-117101

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-001101

116-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2485 1.50
- +

Ajouter au panier

Demander

116-87-316-41-001101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-41-005101

110-83-328-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2504 1.50
- +

Ajouter au panier

Demander

110-83-328-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-008101

116-87-318-41-008101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3065 1.50
- +

Ajouter au panier

Demander

116-87-318-41-008101

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-328-41-001101

612-87-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3812 1.50
- +

Ajouter au panier

Demander

612-87-328-41-001101

Datenblatt

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-628-41-001101

612-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3865 1.75
- +

Ajouter au panier

Demander

612-87-628-41-001101

Datenblatt

Bulk 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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