Thermal - Heat Sinks - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
HSB16-404018 HEAT SINK, BGA, 40 X 40 X 18 MM CUI Devices	1262	2.23	- + Ajouter au panier Demander	Datenblatt	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.575 (40.00mm)	1.575 (40.00mm)	-	0.709 (18.00mm)	9.4W @ 75°C	2.60°C/W @ 200 LFM	7.96°C/W	Aluminum Alloy
647-10ABEP HEATSINK TO-220 W/PINS BLK 1 Wakefield-Vette	5312	1.82	- + Ajouter au panier Demander	Datenblatt	Bulk	647	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.650 (41.91mm)	1.000 (25.40mm)	-	1.000 (25.40mm)	6.0W @ 42°C	3.80°C/W @ 200 LFM	-	Aluminum
DA-T268-301E-TR HEATSINK FOR TO-268 Ohmite	6858	2.67	- + Ajouter au panier Demander	Datenblatt	Tape & Reel (TR),Cut Tape (CT)	D	Active	Top Mount	Solderable Feet	Rectangular, Fins	0.500 (12.70mm)	1.580 (40.13mm)	-	0.460 (11.68mm)	7.0W @ 35°C	4.00°C/W @ 700 LFM	-	Aluminum
580100B00000G HEATSINK SLIDE-ON 8-DIP Aavid, Thermal Division of Boyd Corporation	1001	2.25	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Top Mount	Press Fit, Slide On	Rectangular, Fins	0.562 (14.27mm)	0.600 (15.24mm)	-	0.450 (11.43mm)	1.0W @ 30°C	8.00°C/W @ 500 LFM	30.00°C/W	Aluminum
EA-T220-38E HEATSINK FOR TO-220 BLACK Ohmite	2082	2.26	- + Ajouter au panier Demander	Datenblatt	Box	E	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.500 (38.10mm)	1.378 (35.00mm)	-	0.500 (12.70mm)	8.0W @ 80°C	4.00°C/W @ 300 LFM	10.40°C/W	Aluminum
WV-T220-101E HEATSINK AND CLIP FOR TO-220 Ohmite	426	2.26	- + Ajouter au panier Demander	Datenblatt	Tray	W	Active	Board Level, Vertical	Clip and PC Pin	Rectangular, Fins	1.201 (30.50mm)	0.720 (18.29mm)	-	0.630 (16.00mm)	1.0W @ 20°C	-	13.00°C/W	Aluminum
322605B00000G HEATSINK TO-5 1.25W H=.25 BLK Aavid, Thermal Division of Boyd Corporation	1076	2.31	- + Ajouter au panier Demander	Datenblatt	Bag	-	Active	Top Mount	Press Fit	Cylindrical	-	-	0.315 (8.00mm) ID, 0.750 (19.05mm) OD	0.250 (6.35mm)	1.0W @ 60°C	25.00°C/W @ 200 LFM	54.00°C/W	Aluminum
E2A-T247-38E BLACK ANODIZED HEATSINK Ohmite	1966	2.32	- + Ajouter au panier Demander	Datenblatt	Box	EX	Active	Board Level, Vertical	Bolt On and Board Mounts	Rectangular, Fins	0.641 (16.28mm)	0.642 (16.30mm)	-	1.500 (38.10mm)	4.0W @ 70°C	4.00°C/W @ 300 LFM	14.00°C/W	Aluminum
530613B00000G HEATSINK TO-220 BLACK 1.18 Aavid, Thermal Division of Boyd Corporation	1115	2.32	- + Ajouter au panier Demander	Datenblatt	Bag	-	Active	Board Level	Bolt On	Rectangular, Fins	1.180 (29.97mm)	1.000 (25.40mm)	-	0.500 (12.70mm)	4.0W @ 80°C	6.00°C/W @ 600 LFM	16.70°C/W	Aluminum
658-35ABT4E HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	2454	2.36	- + Ajouter au panier Demander	Datenblatt	Bulk	658	Active	Top Mount	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100 (27.94mm)	1.100 (27.94mm)	-	0.350 (8.89mm)	-	3.00°C/W @ 800 LFM	-	Aluminum
577202B04000G HEATSINK TO-220 .500 COMPACT Aavid, Thermal Division of Boyd Corporation	449	2.36	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	0.750 (19.05mm)	0.520 (13.21mm)	-	0.500 (12.70mm)	1.5W @ 40°C	10.00°C/W @ 200 LFM	24.40°C/W	Aluminum
V2032B HEATSINK CPU FORGED Assmann WSW Components	1383	2.44	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Top Mount	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984 (25.00mm)	0.984 (25.00mm)	-	0.728 (18.50mm)	-	-	5.00°C/W	Aluminum Alloy
573400D00010G HEATSINK D-PAK3 TIN PLATED SMD Aavid, Thermal Division of Boyd Corporation	6592	3.12	- + Ajouter au panier Demander	Datenblatt	Tape & Reel (TR),Cut Tape (CT)	-	Active	Top Mount	SMD Pad	Rectangular, Fins	0.500 (12.70mm)	1.220 (30.99mm)	-	0.401 (10.20mm)	1.0W @ 20°C	4.00°C/W @ 600 LFM	14.00°C/W	Copper
FIT0818 BLACK ALUMINUM HEATSINKKIT FOR R DFRobot	467	2.50	- + Ajouter au panier Demander		Bulk	-	Active	Top Mount	Thermal Tape, Adhesive (Included)	Rectangular, Pin Fins	-	-	-	-	-	-	-	Aluminum
658-45ABT3 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	31738	2.51	- + Ajouter au panier Demander	Datenblatt	Bulk	658	Active	Top Mount	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100 (27.94mm)	1.100 (27.94mm)	-	0.450 (11.43mm)	3.0W @ 50°C	6.00°C/W @ 200 LFM	-	Aluminum
M48079B011000G MAX CLIP HEATSINK Aavid, Thermal Division of Boyd Corporation	143	2.51	- + Ajouter au panier Demander	Datenblatt	Bulk	Max Clip System™	Active	Board Level, Vertical	Clip and PC Pin	Rectangular, Angled Fins	0.790 (20.07mm)	0.866 (22.00mm)	-	1.516 (38.50mm)	-	-	-	Aluminum
HSB17-404025 HEAT SINK, BGA, 40 X 40 X 25 MM CUI Devices	180	2.53	- + Ajouter au panier Demander	Datenblatt	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.575 (40.00mm)	1.575 (40.00mm)	-	0.984 (25.00mm)	11.7W @ 75°C	2.10°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy
374324B00035G HEATSINK BGA W/ADHESIVE TAPE Aavid, Thermal Division of Boyd Corporation	2754	2.54	- + Ajouter au panier Demander	Datenblatt	Box	37432	Active	Board Level	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.063 (27.00mm)	1.063 (27.00mm)	-	0.394 (10.00mm)	3.0W @ 90°C	9.30°C/W @ 200 LFM	30.60°C/W	Aluminum
573300D00000G TOP MOUNT HEATSINK .4 D2PAK Aavid, Thermal Division of Boyd Corporation	2509	2.58	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Top Mount	SMD Pad	Rectangular, Fins	0.500 (12.70mm)	1.030 (26.16mm)	-	0.400 (10.16mm)	1.3W @ 30°C	8.00°C/W @ 300 LFM	18.00°C/W	Aluminum
501100B00000G HEATSINK 14-DIP/16-DIP Aavid, Thermal Division of Boyd Corporation	1292	2.60	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Top Mount	Thermal Tape, Adhesive (Not Included)	Rectangular, Fins	0.750 (19.05mm)	0.250 (6.35mm)	-	0.190 (4.83mm)	0.4W @ 30°C	30.00°C/W @ 500 LFM	67.00°C/W	Aluminum

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