Thermal - Heat Sinks - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	PackageCooled	AttachmentMethod	Shape	Length	Width	Diameter	FinHeight	PowerDissipation@TemperatureRise	ThermalResistance@ForcedAirFlow	ThermalResistance@Natural
V6560Y HEATSINK ALUM ANOD Assmann WSW Components	2103	0.79	- + Ajouter au panier Demander	Datenblatt	Tray	-	Active	Board Level	Bolt On and PC Pin	Rectangular, Fins	1.969 (50.00mm)	1.181 (30.00mm)	-	0.472 (12.00mm)	-	-	7.00°C/W	Aluminum
V8813X HEATSINK TO-220/TOP-3/SOT-32 Assmann WSW Components	2404	0.81	- + Ajouter au panier Demander	Datenblatt	Tray	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.496 (38.00mm)	1.359 (34.50mm)	-	0.492 (12.50mm)	-	-	5.00°C/W	Aluminum
HSB08-212106 HEAT SINK, BGA, 21 X 21 X 6 MM CUI Devices	3713	0.89	- + Ajouter au panier Demander	Datenblatt	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.827 (21.00mm)	0.827 (21.00mm)	-	0.236 (6.00mm)	3.0W @ 75°C	9.70°C/W @ 200 LFM	25.40°C/W	Aluminum Alloy
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM CUI Devices	3353	0.93	- + Ajouter au panier Demander	Datenblatt	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.827 (21.00mm)	0.827 (21.00mm)	-	0.591 (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy
HSB05-171711 HEAT SINK, BGA, 17 X 17 X 11.5 M CUI Devices	3624	1.08	- + Ajouter au panier Demander	Datenblatt	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	0.669 (17.00mm)	0.669 (17.00mm)	-	0.453 (11.50mm)	3.1W @ 75°C	8.40°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy
DA-T263-201E-TR HEATSINK FOR TO-263 Ohmite	2060	2.19	- + Ajouter au panier Demander	Datenblatt	Tape & Reel (TR),Cut Tape (CT)	D	Active	Top Mount	Solderable Feet	Rectangular, Fins	0.500 (12.70mm)	1.020 (25.91mm)	-	0.480 (12.19mm)	2.0W @ 30°C	8.00°C/W @ 500 LFM	-	Aluminum
HSE-B20250-045H HEAT SINK, EXTRUSION, TO-220, 50 CUI Devices	2957	1.11	- + Ajouter au panier Demander	Datenblatt	Box	HSE	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.969 (50.00mm)	1.181 (30.00mm)	-	0.472 (12.00mm)	7.7W @ 75°C	4.05°C/W @ 200 LFM	9.74°C/W	Aluminum Alloy
577404B00000G HEATSINK TO-202 LOW PROFILE .5 Aavid, Thermal Division of Boyd Corporation	3418	1.89	- + Ajouter au panier Demander	Datenblatt	Bag	-	Active	Board Level	Bolt On	Rectangular, Fins	0.750 (19.05mm)	0.520 (13.21mm)	-	0.500 (12.70mm)	2.0W @ 50°C	10.00°C/W @ 200 LFM	24.00°C/W	Aluminum
TGH-0200-02 ALUMINIUM HEAT SINK 20X20MM t-Global Technology	2604	1.90	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Top Mount	-	Square, Fins	0.787 (20.00mm)	0.787 (20.00mm)	-	0.236 (6.00mm)	-	-	-	Aluminum
E2A-T220-25E BLACK ANODIZED HEATSINK Ohmite	589	1.92	- + Ajouter au panier Demander	Datenblatt	Box	EX	Active	Board Level, Vertical	Bolt On and Board Mounts	Rectangular, Fins	0.641 (16.28mm)	0.642 (16.30mm)	-	1.000 (25.40mm)	2.0W @ 40°C	4.00°C/W @ 500 LFM	16.40°C/W	Aluminum
HSB21-454515 HEAT SINK, BGA, 45 X 45 X 15 MM CUI Devices	3430	2.03	- + Ajouter au panier Demander	Datenblatt	Box	HSB	Active	Top Mount	Adhesive	Square, Pin Fins	1.772 (45.00mm)	1.772 (45.00mm)	-	0.591 (15.00mm)	9.9W @ 75°C	2.80°C/W @ 200 LFM	7.56°C/W	Aluminum Alloy
530714B00000G HEATSINK TO-220 LIGHTWEIGHT .5 Aavid, Thermal Division of Boyd Corporation	2970	2.18	- + Ajouter au panier Demander	Datenblatt	Bag	-	Active	Board Level	Bolt On	Rectangular, Fins	0.710 (18.03mm)	1.000 (25.40mm)	-	0.500 (12.70mm)	2.0W @ 40°C	4.00°C/W @ 700 LFM	20.30°C/W	Aluminum
TGH-0220-03 ALUMINIUM HEAT SINK 22X22MM t-Global Technology	220	2.29	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Top Mount	-	Square, Pin Fins	0.866 (22.00mm)	0.866 (22.00mm)	-	0.354 (9.00mm)	-	-	-	Aluminum
658-25ABT4E HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	2560	2.32	- + Ajouter au panier Demander	Datenblatt	Bulk	658	Active	Top Mount	Adhesive	Square, Pin Fins	1.100 (27.94mm)	1.100 (27.94mm)	-	0.250 (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum
542502B00000G HEATSINK TO-220 TAB BLACK Aavid, Thermal Division of Boyd Corporation	2277	2.34	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Board Level, Vertical	Bolt On and PC Pin	Rectangular, Fins	1.250 (31.75mm)	0.875 (22.22mm)	-	0.250 (6.35mm)	2.5W @ 60°C	4.00°C/W @ 700 LFM	24.00°C/W	Aluminum
658-60ABT3 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	3889	2.57	- + Ajouter au panier Demander	Datenblatt	Bulk	658	Active	Top Mount	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100 (27.94mm)	1.100 (27.94mm)	-	0.598 (15.20mm)	2.5W @ 30°C	2.00°C/W @ 500 LFM	-	Aluminum
7142DG HEATSINK TO-220 TIN CLIP-ON 21MM Aavid, Thermal Division of Boyd Corporation	3765	2.76	- + Ajouter au panier Demander	Datenblatt	Bulk	-	Active	Board Level	Clip and Board Locks	Rectangular, Fins	0.780 (19.81mm)	0.520 (13.21mm)	-	0.515 (13.08mm)	1.0W @ 30°C	8.00°C/W @ 400 LFM	20.30°C/W	Copper
BDN10-3CB/A01 HEATSINK CPU W/ADHESIVE 1.01SQ CTS Thermal Management Products	3159	2.83	- + Ajouter au panier Demander	Datenblatt	Box	BDN	Active	Top Mount	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.010 (25.65mm)	1.010 (25.65mm)	-	0.355 (9.02mm)	-	8.00°C/W @ 400 LFM	26.40°C/W	Aluminum
ATS-CPX050050010-121-C1-R0 HEATSINK 50X50X10MM XCUT CP Advanced Thermal Solutions Inc.	2840	3.01	- + Ajouter au panier Demander	Datenblatt	Tray	pushPIN™	Active	Top Mount	Push Pin	Square, Fins	1.969 (50.00mm)	1.969 (50.00mm)	-	0.394 (10.00mm)	-	9.46°C/W @ 100 LFM	-	Aluminum
ATS-CPX025025025-140-C1-R0 HEATSINK 25X25X25MM L-TAB CP Advanced Thermal Solutions Inc.	2501	3.05	- + Ajouter au panier Demander	Datenblatt	Tray	pushPIN™	Active	Top Mount	Push Pin	Square, Fins	0.984 (25.00mm)	0.984 (25.00mm)	-	0.984 (25.00mm)	-	7.21°C/W @ 100 LFM	-	Aluminum

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