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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
SMPX-32LCC-N

SMPX-32LCC-N

SMT PLCC SOCKET 32P NON POLARISE

Kycon, Inc.

3832 1.04
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SMPX-32LCC-N

Datenblatt

Tube SMPX Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
SMPX-28LCC-P

SMPX-28LCC-P

SMT PLCC SOCKET 28P POLARISED RO

Kycon, Inc.

2809 1.04
- +

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Demander

SMPX-28LCC-P

Datenblatt

Tube SMPX Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
SMPX-32LCC-P

SMPX-32LCC-P

SMT PLCC SOCKET 32P POLARISED RO

Kycon, Inc.

2546 1.04
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SMPX-32LCC-P

Datenblatt

Tube SMPX Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
8420-21B1-RK-TR

8420-21B1-RK-TR

CONN SOCKET PLCC 20POS TIN

3M

2304 1.04
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8420-21B1-RK-TR

Datenblatt

Tape & Reel (TR) 8400 Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
612-83-314-41-001101

612-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3884 0.98
- +

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Demander

612-83-314-41-001101

Datenblatt

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-318-41-001101

115-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2506 1.02
- +

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Demander

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-324-41-003101

115-87-324-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2880 0.98
- +

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Demander

115-87-324-41-003101

Datenblatt

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-424-41-003101

115-87-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2880 0.98
- +

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Demander

115-87-424-41-003101

Datenblatt

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-037-10-061101

510-87-037-10-061101

CONN SOCKET PGA 37POS GOLD

Preci-Dip

3759 1.12
- +

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Demander

510-87-037-10-061101

Datenblatt

Bulk 510 Active PGA 37 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SMPX-52LCC-N-TR

SMPX-52LCC-N-TR

SMT PLCC 52P NON POLARISED, T&R

Kycon, Inc.

2156 1.05
- +

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Demander

SMPX-52LCC-N-TR

Datenblatt

Tape & Reel (TR) SMPX Active PLCC 52 (4 x 13) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
ED084PLCZ

ED084PLCZ

CONN SOCKET PLCC 84POS TIN

On Shore Technology Inc.

3502 1.05
- +

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Demander

ED084PLCZ

Datenblatt

Tube ED Active PLCC 84 (2x42) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
06-3513-10T

06-3513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3045 1.06
- +

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Demander

06-3513-10T

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-318-41-005101

110-83-318-41-005101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2717 1.00
- +

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Demander

110-83-318-41-005101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-605101

110-83-318-41-605101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2448 1.00
- +

Ajouter au panier

Demander

110-83-318-41-605101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-001101

110-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2092 1.00
- +

Ajouter au panier

Demander

110-83-320-41-001101

Datenblatt

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-001151

110-83-320-41-001151

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3116 1.00
- +

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Demander

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-420-41-001101

110-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3302 1.00
- +

Ajouter au panier

Demander

110-83-420-41-001101

Datenblatt

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 18-HZW/TN

AR 18-HZW/TN

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

3164 1.07
- +

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Demander

AR 18-HZW/TN

Datenblatt

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
114-87-624-41-117101

114-87-624-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3912 1.00
- +

Ajouter au panier

Demander

114-87-624-41-117101

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-624-41-134161

114-87-624-41-134161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2069 1.00
- +

Ajouter au panier

Demander

114-87-624-41-134161

Datenblatt

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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