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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
824-AG32D-LF

824-AG32D-LF

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

2568 0.00
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Demander

824-AG32D-LF

Datenblatt

Tube 800 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1571586-6

1571586-6

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

3540 0.00
- +

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Demander

1571586-6

Datenblatt

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1-1571586-0

1-1571586-0

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors

3993 0.00
- +

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Demander

1-1571586-0

Datenblatt

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571586-7

2-1571586-7

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

3344 0.00
- +

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Demander

2-1571586-7

Datenblatt

Tube 800 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-1571586-8

2-1571586-8

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

2744 4.02
- +

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Demander

2-1571586-8

Datenblatt

Tube,Box 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3-1571586-1

3-1571586-1

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors

3685 0.00
- +

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Demander

3-1571586-1

Datenblatt

Tube 800 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3-1571586-5

3-1571586-5

CONN IC DIP SOCKET 64POS GOLD

TE Connectivity AMP Connectors

2194 0.00
- +

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Demander

3-1571586-5

Datenblatt

Tube 800 Obsolete DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
5-1814640-0

5-1814640-0

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

3915 0.00
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Demander

5-1814640-0

Datenblatt

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
5-1814640-6

5-1814640-6

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors

2995 0.00
- +

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Demander

5-1814640-6

Datenblatt

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
1814642-8

1814642-8

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

3229 0.00
- +

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Demander

1814642-8

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester
1-1814642-0

1-1814642-0

CONN IC DIP SOCKET 10POS TIN

TE Connectivity AMP Connectors

3158 0.00
- +

Ajouter au panier

Demander

1-1814642-0

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 196.9µin (5.00µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Thermoplastic, Polyester
1-1814642-1

1-1814642-1

CONN IC DIP SOCKET 10POS GOLD

TE Connectivity AMP Connectors

2103 0.00
- +

Ajouter au panier

Demander

1-1814642-1

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Thermoplastic, Polyester
1-1814642-3

1-1814642-3

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

3043 0.00
- +

Ajouter au panier

Demander

1-1814642-3

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester
2-1814642-5

2-1814642-5

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

2907 0.00
- +

Ajouter au panier

Demander

2-1814642-5

Datenblatt

Tube - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester
1825046-2

1825046-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

3403 0.00
- +

Ajouter au panier

Demander

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) - - Brass -
1825046-3

1825046-3

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors

2296 0.00
- +

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Demander

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) - - Brass -
1825046-9

1825046-9

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

3270 0.00
- +

Ajouter au panier

Demander

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) - - Brass -
2-1825046-2

2-1825046-2

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

3463 0.00
- +

Ajouter au panier

Demander

Tube 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) - - Brass -
2-1825046-3

2-1825046-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

3503 0.00
- +

Ajouter au panier

Demander

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) - - Brass -
2-1825046-4

2-1825046-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

3129 0.00
- +

Ajouter au panier

Demander

Tube 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) - - Brass -
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