Bienvenue à visiter Élément Technology Co., Ltd.!

+86 15361839241 +86 0755-23603516
Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
AR48-HZL-TT

AR48-HZL-TT

CONN IC DIP SOCKET 48POS TIN

Assmann WSW Components

3173 0.00
- +

Ajouter au panier

Demander

AR48-HZL-TT

Datenblatt

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR64-HZL-TT

AR64-HZL-TT

CONN IC DIP SOCKET 64POS TIN

Assmann WSW Components

2532 0.00
- +

Ajouter au panier

Demander

AR64-HZL-TT

Datenblatt

Bag - Obsolete DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
216-6278-00-3303

216-6278-00-3303

CONN IC DIP SOCKET ZIF 16POS GLD

3M

3139 0.00
- +

Ajouter au panier

Demander

216-6278-00-3303

Datenblatt

Tube OEM Obsolete DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled
220-4842-00-3303

220-4842-00-3303

CONN IC DIP SOCKET ZIF 20POS GLD

3M

2100 0.00
- +

Ajouter au panier

Demander

220-4842-00-3303

Datenblatt

Bulk OEM Obsolete DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled
240-4846-00-3303

240-4846-00-3303

CONN IC DIP SOCKET ZIF 40POS GLD

3M

3085 0.00
- +

Ajouter au panier

Demander

240-4846-00-3303

Datenblatt

Bulk OEM Obsolete DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled
28-536-11

28-536-11

CONN SOCKET PLCC ZIF 28POS GOLD

Aries Electronics

3123 0.00
- +

Ajouter au panier

Demander

- 536 Obsolete PLCC, ZIF (ZIP) 28 (4 x 7) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
44-536-11

44-536-11

CONN SOCKET PLCC ZIF 44POS GOLD

Aries Electronics

2361 0.00
- +

Ajouter au panier

Demander

- 536 Obsolete PLCC, ZIF (ZIP) 44 (4 x 11) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
68-536-11

68-536-11

CONN SOCKET PLCC ZIF 68POS GOLD

Aries Electronics

2434 0.00
- +

Ajouter au panier

Demander

- 536 Obsolete PLCC, ZIF (ZIP) 68 (4 x 17) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
84-536-11

84-536-11

CONN SOCKET PLCC ZIF 84POS GOLD

Aries Electronics

3086 0.00
- +

Ajouter au panier

Demander

- 536 Obsolete PLCC, ZIF (ZIP) 84 (4 x 21) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
523-93-168-17-101002

523-93-168-17-101002

PGA SOCK 168 PIN 17X17 WIRE WD

Mill-Max Manufacturing Corp.

2130 0.00
- +

Ajouter au panier

Demander

523-93-168-17-101002

Datenblatt

Bulk 523 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-169-17-101002

523-93-169-17-101002

PGA SOCK 169 PIN 17X17 WIRE WD

Mill-Max Manufacturing Corp.

3391 0.00
- +

Ajouter au panier

Demander

523-93-169-17-101002

Datenblatt

Bulk 523 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
C9314-02

C9314-02

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2567 0.00
- +

Ajouter au panier

Demander

C9314-02

Datenblatt

Bulk Lo-PRO®file, C93 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
0009483031

0009483031

CONN SOCKET TRANSIST TO-220 3POS

Molex

2660 0.00
- +

Ajouter au panier

Demander

0009483031

Datenblatt

Bulk - Obsolete Transistor, TO-220 3 (Rectangular) - Tin 100.0µin (2.54µm) Brass Through Hole Closed Frame Solder - Tin 100.0µin (2.54µm) Brass Polyamide (PA66), Nylon 6/6
0010182031

0010182031

CONN SOCKET TRANSIST TO-220 3POS

Molex

3600 0.00
- +

Ajouter au panier

Demander

0010182031

Datenblatt

- 4038 Obsolete Transistor, TO-220 3 (Rectangular) 0.100 (2.54mm) Tin - Brass Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Brass Polyester, Glass Filled
0050395288

0050395288

CONN IC DIP SOCKET 28POS TINLEAD

Molex

2020 0.00
- +

Ajouter au panier

Demander

0050395288

Datenblatt

- - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin-Lead - - Through Hole Closed Frame - - - - - -
52-536-11

52-536-11

CONN SOCKET PLCC ZIF 52POS GOLD

Aries Electronics

3298 0.00
- +

Ajouter au panier

Demander

- 536 Obsolete PLCC, ZIF (ZIP) 52 (4 x 13) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
2100-7243-00-1807

2100-7243-00-1807

CONN SOCKET PQFP 100POS TIN-LEAD

3M

2431 0.00
- +

Ajouter au panier

Demander

2100-7243-00-1807

Datenblatt

Bulk OEM Obsolete QFP 100 (4 x 25) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
268-5401-00-1102JH

268-5401-00-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

2262 0.00
- +

Ajouter au panier

Demander

268-5401-00-1102JH

Datenblatt

Tray OEM Obsolete CLCC 68 (4 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
268-5401-11-1102JH

268-5401-11-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

2015 0.00
- +

Ajouter au panier

Demander

268-5401-11-1102JH

Datenblatt

Bulk OEM Obsolete CLCC 68 (4 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
268-5401-50-1102JH

268-5401-50-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

3289 0.00
- +

Ajouter au panier

Demander

268-5401-50-1102JH

Datenblatt

Bulk OEM Obsolete CLCC 68 (4 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 739740741742743744745746...1100Next»
Demander un devis
Numéro de pièce
Quantité
Contact
E-Mail
Commentaires
  • Maison

    Maison

    Produits

    Produits

    Téléphone

    Téléphone

    Utilisateurs

    Utilisateurs