Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
117-43-652-41-005000 CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp.	3022	8.26	- + Ajouter au panier Demander	Datenblatt	Tube	117	Active	DIP, 0.6 (15.24mm) Row Spacing	52 (2 x 26)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-93-624-41-801000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	3653	8.39	- + Ajouter au panier Demander	Datenblatt	Tube	123	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame, Decoupling Capacitor	Wire Wrap	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
506-AG10D CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors	2953	8.73	- + Ajouter au panier Demander	Datenblatt	Tube	500	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Brass	-
25-0511-10 CONN SOCKET SIP 25POS TIN Aries Electronics	2340	8.12	- + Ajouter au panier Demander	Datenblatt	Tube	511	Active	SIP	25 (1 x 25)	0.100 (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100 (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
APA-628-G-A1 ADAPTER PLUG Samtec Inc.	3141	14.88	- + Ajouter au panier Demander		Bulk	APA	Active	-	28 (2 x 14)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
28-823-90C CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3707	15.89	- + Ajouter au panier Demander	Datenblatt	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-6574-10 CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics	3925	15.95	- + Ajouter au panier Demander	Datenblatt	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
FMC05DRTN-S1682 CONN TRANSIST TO-220/TO-247 5POS Sullins Connector Solutions	2681	15.98	- + Ajouter au panier Demander	Datenblatt	Tray	-	Active	Transistor, TO-220 and TO-247	5 (Rectangular)	-	Gold	30.0µin (0.76µm)	Nickel Boron	Through Hole	-	Solder	-	Gold	30.0µin (0.76µm)	Nickel Boron	Polyphenylene Sulfide (PPS)
111-93-210-41-001000 CONN IC DIP SOCKET 10POS GOLD Mill-Max Manufacturing Corp.	3792	15.85	- + Ajouter au panier Demander	Datenblatt	Tube	111	Active	DIP, 0.2 (5.08mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-314-41-105000 CONN IC DIP SOCKET 14POS GOLD Mill-Max Manufacturing Corp.	2332	16.07	- + Ajouter au panier Demander	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-420-41-001000 CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp.	658	16.25	- + Ajouter au panier Demander	Datenblatt	Tube	110	Active	DIP, 0.4 (10.16mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
848-AG10D CONN IC DIP SOCKET 48POS GOLD TE Connectivity AMP Connectors	2842	16.42	- + Ajouter au panier Demander	Datenblatt	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Copper Alloy	Polyester
115-47-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	2892	16.45	- + Ajouter au panier Demander	Datenblatt	Tube	115	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-428-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2372	16.53	- + Ajouter au panier Demander	Datenblatt	Tube	111	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-316-41-605000 CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp.	3343	16.62	- + Ajouter au panier Demander	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-432-41-001000 CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp.	3471	17.18	- + Ajouter au panier Demander	Datenblatt	Tube	110	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-322-41-105000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	3565	17.31	- + Ajouter au panier Demander	Datenblatt	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-93-628-41-005000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp.	197	18.43	- + Ajouter au panier Demander	Datenblatt	Tube	117	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.070 (1.78mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-624-31-012000 CONN IC DIP SOCKET 24POS GOLD Mill-Max Manufacturing Corp.	3873	19.09	- + Ajouter au panier Demander	Datenblatt	Tube	614	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
8058-1G30 CONN TRANSIST TO-5 4POS GOLD TE Connectivity AMP Connectors	2773	19.49	- + Ajouter au panier Demander	Datenblatt	Bulk	8058	Obsolete	Transistor, TO-5	4 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)

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