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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-0517-90C

16-0517-90C

CONN SOCKET SIP 16POS GOLD

Aries Electronics

3790 7.18
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16-0517-90C

Datenblatt

Bulk 0517 Active SIP 16 (1 x 16) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-232-17-061101

510-87-232-17-061101

CONN SOCKET PGA 232POS GOLD

Preci-Dip

3174 6.79
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510-87-232-17-061101

Datenblatt

Bulk 510 Active PGA 232 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
13-0511-10

13-0511-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

2499 7.20
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13-0511-10

Datenblatt

Bulk 511 Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-10E

16-3518-10E

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2974 7.20
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16-3518-10E

Datenblatt

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-87-078-13-061117

514-87-078-13-061117

CONN SOCKET PGA 78POS GOLD

Preci-Dip

3374 6.81
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514-87-078-13-061117

Datenblatt

Bulk 514 Active PGA 78 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-422-T-M

APA-422-T-M

ADAPTER PLUG

Samtec Inc.

3946 7.21
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Bulk APA Active - 22 (2 x 11) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-87-233-18-071101

510-87-233-18-071101

CONN SOCKET PGA 233POS GOLD

Preci-Dip

3609 6.82
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510-87-233-18-071101

Datenblatt

Bulk 510 Active PGA 233 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-6511-11

10-6511-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2207 7.22
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10-6511-11

Datenblatt

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-47-304-41-006000

116-47-304-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2209 7.23
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116-47-304-41-006000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-822-90E

16-822-90E

16 PIN RT ANGLE HORIZONTAL SOCKT

Aries Electronics

2424 7.25
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Demander

- Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
123-43-320-41-801000

123-43-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3879 7.26
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Demander

123-43-320-41-801000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-138-41-013000

346-93-138-41-013000

CONN SOCKET SIP 38POS GOLD

Mill-Max Manufacturing Corp.

3494 7.26
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Demander

346-93-138-41-013000

Datenblatt

Bulk 346 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-304-41-006000

116-41-304-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2196 7.28
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Demander

116-41-304-41-006000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-304-41-006000

116-91-304-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2497 7.28
- +

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Demander

116-91-304-41-006000

Datenblatt

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-9513-10

32-9513-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3897 7.29
- +

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32-9513-10

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-4518-10H

24-4518-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3996 7.29
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24-4518-10H

Datenblatt

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0508-20

15-0508-20

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2287 7.29
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Demander

15-0508-20

Datenblatt

Bulk 508 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
15-0508-30

15-0508-30

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3447 7.29
- +

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15-0508-30

Datenblatt

Bulk 508 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
510-87-236-17-061101

510-87-236-17-061101

CONN SOCKET PGA 236POS GOLD

Preci-Dip

2377 6.91
- +

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Demander

510-87-236-17-061101

Datenblatt

Bulk 510 Active PGA 236 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-236-17-062101

510-87-236-17-062101

CONN SOCKET PGA 236POS GOLD

Preci-Dip

3541 6.91
- +

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Demander

510-87-236-17-062101

Datenblatt

Bulk 510 Active PGA 236 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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