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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
04-7422-10

04-7422-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3531 6.18
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04-7422-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7425-10

04-7425-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3209 6.18
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04-7425-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7430-10

04-7430-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3452 6.18
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04-7430-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7445-10

04-7445-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3632 6.18
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04-7445-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7482-10

04-7482-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3805 6.18
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04-7482-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7500-10

04-7500-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2129 6.18
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Demander

04-7500-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7533-10

04-7533-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3229 6.18
- +

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Demander

04-7533-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7545-10

04-7545-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3759 6.18
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Demander

04-7545-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7550-10

04-7550-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3108 6.18
- +

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Demander

04-7550-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7560-10

04-7560-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2261 6.18
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Demander

04-7560-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7700-10

04-7700-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3982 6.18
- +

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Demander

04-7700-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7755-10

04-7755-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3126 6.18
- +

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Demander

04-7755-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7800-10

04-7800-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3684 6.18
- +

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Demander

04-7800-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7850-10

04-7850-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3041 6.18
- +

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Demander

04-7850-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-7950-10

04-7950-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2153 6.18
- +

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Demander

04-7950-10

Datenblatt

Bulk 700 Elevator Strip-Line™ Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
XR2A3221N

XR2A3221N

CONN IC DIP SOCKET 32POS GOLD

Omron Electronics Inc-EMC Div

3641 6.19
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Demander

XR2A3221N

Datenblatt

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
ICA-324-SGT

ICA-324-SGT

.100 SCREW MACHINE DIP SOCKET

Samtec Inc.

3746 6.19
- +

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Demander

Tube ICA Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
116-83-624-41-013101

116-83-624-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3809 5.86
- +

Ajouter au panier

Demander

116-83-624-41-013101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-013101

116-83-324-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3805 5.86
- +

Ajouter au panier

Demander

116-83-324-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-013101

116-83-424-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3599 5.86
- +

Ajouter au panier

Demander

116-83-424-41-013101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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