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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-081-12-071101

510-83-081-12-071101

CONN SOCKET PGA 81POS GOLD

Preci-Dip

2689 4.12
- +

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Demander

510-83-081-12-071101

Datenblatt

Bulk 510 Active PGA 81 (12 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-952-41-001101

612-87-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3759 4.13
- +

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Demander

612-87-952-41-001101

Datenblatt

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-133-14-071101

510-87-133-14-071101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

2730 4.13
- +

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Demander

510-87-133-14-071101

Datenblatt

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-318-41-013101

116-83-318-41-013101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2374 4.14
- +

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Demander

116-83-318-41-013101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-004101

116-83-328-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3678 4.49
- +

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Demander

116-83-328-41-004101

Datenblatt

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-004101

116-83-428-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3268 4.49
- +

Ajouter au panier

Demander

116-83-428-41-004101

Datenblatt

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-964-31-012101

614-87-964-31-012101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3307 4.47
- +

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Demander

614-87-964-31-012101

Datenblatt

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-100-11-001101

510-83-100-11-001101

CONN SOCKET PGA 100POS GOLD

Preci-Dip

2732 4.79
- +

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Demander

510-83-100-11-001101

Datenblatt

Bulk 510 Active PGA 100 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-43-314-41-801000

123-43-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3739 4.93
- +

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Demander

123-43-314-41-801000

Datenblatt

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-308-G-A

APA-308-G-A

ADAPTER PLUG

Samtec Inc.

2500 4.94
- +

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Demander

Bulk APA Active - 8 (2 x 4) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-320-T-A1

APA-320-T-A1

ADAPTER PLUG

Samtec Inc.

3280 4.94
- +

Ajouter au panier

Demander

Bulk APA Active - 20 (2 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-87-155-16-003101

510-87-155-16-003101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

2902 4.67
- +

Ajouter au panier

Demander

510-87-155-16-003101

Datenblatt

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-155-16-093101

510-87-155-16-093101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

2669 4.67
- +

Ajouter au panier

Demander

510-87-155-16-093101

Datenblatt

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-632-41-105191

110-83-632-41-105191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2637 4.21
- +

Ajouter au panier

Demander

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-122-41-013000

346-93-122-41-013000

CONN SOCKET SIP 22POS GOLD

Mill-Max Manufacturing Corp.

3180 4.38
- +

Ajouter au panier

Demander

346-93-122-41-013000

Datenblatt

Bulk 346 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-122-41-013000

346-43-122-41-013000

CONN SOCKET SIP 22POS GOLD

Mill-Max Manufacturing Corp.

3991 4.38
- +

Ajouter au panier

Demander

346-43-122-41-013000

Datenblatt

Bulk 346 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-83-640-41-801101

110-83-640-41-801101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2412 4.14
- +

Ajouter au panier

Demander

110-83-640-41-801101

Datenblatt

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-018101

116-83-648-41-018101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2087 4.40
- +

Ajouter au panier

Demander

116-83-648-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-428-41-002101

124-83-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3199 4.14
- +

Ajouter au panier

Demander

Bulk 124 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-628-41-002101

124-83-628-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3736 4.26
- +

Ajouter au panier

Demander

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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