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Photos Le fabricant# Stocks Prix Quantité Tableau Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
714-43-212-31-018000

714-43-212-31-018000

CONN IC DIP SOCKET 12POS GOLD

Mill-Max Manufacturing Corp.

2448 3.88
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714-43-212-31-018000

Datenblatt

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
12-3513-10H

12-3513-10H

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2639 3.89
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12-3513-10H

Datenblatt

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0513-10H

17-0513-10H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3851 3.89
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17-0513-10H

Datenblatt

Bulk 0513 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-10H

28-0518-10H

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3339 3.89
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28-0518-10H

Datenblatt

Bulk 518 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-10H

28-1518-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3139 3.89
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28-1518-10H

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-121-13-061101

510-87-121-13-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

3681 3.65
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510-87-121-13-061101

Datenblatt

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-15-001101

510-87-121-15-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

2988 3.76
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510-87-121-15-001101

Datenblatt

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-15-061101

510-87-121-15-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

3895 3.76
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510-87-121-15-061101

Datenblatt

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-001101

510-83-072-11-001101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

2510 3.66
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510-83-072-11-001101

Datenblatt

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-041101

510-83-072-11-041101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

2865 3.66
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510-83-072-11-041101

Datenblatt

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-072-11-061101

510-83-072-11-061101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

2798 3.66
- +

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Demander

510-83-072-11-061101

Datenblatt

Bulk 510 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-11-000101

510-87-121-11-000101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

3393 3.65
- +

Ajouter au panier

Demander

510-87-121-11-000101

Datenblatt

Bulk 510 Active PGA 121 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-13-001101

510-87-121-13-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

2572 3.65
- +

Ajouter au panier

Demander

510-87-121-13-001101

Datenblatt

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-121-13-041101

510-87-121-13-041101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

2682 3.65
- +

Ajouter au panier

Demander

510-87-121-13-041101

Datenblatt

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-018101

116-83-640-41-018101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3694 3.67
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116-83-640-41-018101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-006101

116-83-642-41-006101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2424 3.67
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Demander

116-83-642-41-006101

Datenblatt

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-93-316-31-012000

614-93-316-31-012000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

2438 3.91
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Demander

614-93-316-31-012000

Datenblatt

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
34-1518-10

34-1518-10

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3038 3.91
- +

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Demander

34-1518-10

Datenblatt

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-823-90T

08-823-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3917 3.91
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08-823-90T

Datenblatt

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
09-0517-90C

09-0517-90C

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2470 3.91
- +

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09-0517-90C

Datenblatt

Bulk 0517 Active SIP 9 (1 x 9) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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