Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
114-83-636-41-117101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3454	2.47	- + Ajouter au panier Demander	Datenblatt	Bulk	114	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-432-41-001101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	2166	2.25	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-428-31-012101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	2465	2.26	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-628-31-012101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3829	2.42	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-075-11-001101 CONN SOCKET PGA 75POS GOLD Preci-Dip	3750	2.26	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	75 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-648-41-117101 CONN IC DIP SOCKET 48POS GOLD Preci-Dip	3261	2.26	- + Ajouter au panier Demander	Datenblatt	Bulk	114	Active	DIP, 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-008101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3056	2.26	- + Ajouter au panier Demander	Datenblatt	Tube	116	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-008101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3495	2.26	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-314-10-001101 CONN IC DIP SOCKET 14POS GOLD Preci-Dip	2308	2.26	- + Ajouter au panier Demander	Datenblatt	Tube	299	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-012101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3057	2.26	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-052-09-041101 CONN SOCKET PGA 52POS GOLD Preci-Dip	2361	2.26	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	52 (9 x 9)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-640-41-005101 CONN IC DIP SOCKET 40POS GOLD Preci-Dip	2633	2.43	- + Ajouter au panier Demander	Datenblatt	Bulk	117	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.070 (1.78mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
21-0518-10 CONN SOCKET SIP 21POS GOLD Aries Electronics	2083	2.42	- + Ajouter au panier Demander	Datenblatt	Bulk	518	Active	SIP	21 (1 x 21)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
110-87-324-41-105191 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	2517	2.33	- + Ajouter au panier Demander		Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-318-41-002101 CONN IC DIP SOCKET 18POS GOLD Preci-Dip	2333	2.27	- + Ajouter au panier Demander		Bulk	124	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-636-41-006101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	2116	2.27	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-003101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	3580	2.27	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-003101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	3554	2.27	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-008101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	3030	2.43	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-322-41-007101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	2486	2.28	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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