Sockets for ICs, Transistors - Élément Technology Co., Ltd.

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Le fabricant#	Stocks	Prix	Quantité	Tableau	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
110-83-632-41-605101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	2877	1.90	- + Ajouter au panier Demander	Datenblatt	Bulk	110	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-430-41-105101 CONN IC DIP SOCKET 30POS GOLD Preci-Dip	2562	1.90	- + Ajouter au panier Demander	Datenblatt	Bulk	117	Active	DIP, 0.4 (10.16mm) Row Spacing	30 (2 x 15)	0.070 (1.78mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.070 (1.78mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-324-41-036101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	2176	1.90	- + Ajouter au panier Demander	Datenblatt	Bulk	146	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-424-41-035101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3197	1.90	- + Ajouter au panier Demander	Datenblatt	Bulk	146	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-424-41-036101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3454	1.90	- + Ajouter au panier Demander	Datenblatt	Bulk	146	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Press-Fit	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-432-31-012101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	3682	1.90	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.4 (10.16mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-632-31-012101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip	2046	2.04	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-328-41-001101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3183	1.90	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-007101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3776	1.91	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-007101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3334	2.09	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-801101 CONN IC DIP SOCKET 20POS GOLD Preci-Dip	3343	1.91	- + Ajouter au panier Demander	Datenblatt	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-044-08-031101 CONN SOCKET PGA 44POS GOLD Preci-Dip	2710	1.91	- + Ajouter au panier Demander	Datenblatt	Bulk	510	Active	PGA	44 (8 x 8)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-006101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3520	2.10	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-636-41-001101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3473	2.10	- + Ajouter au panier Demander	Datenblatt	Bulk	110	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-003101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip	2805	1.92	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-636-41-105101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3607	2.11	- + Ajouter au panier Demander	Datenblatt	Bulk	110	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-636-41-001101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3617	2.11	- + Ajouter au panier Demander	Datenblatt	Bulk	614	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-008101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3264	2.06	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-012101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3471	1.93	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-012101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3562	2.26	- + Ajouter au panier Demander	Datenblatt	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

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